Length scale effects on recrystallization and texture evolution in Cu layers of a roll-bonded Cu-Nb composite

Materials Science and Engineering: A

Volumn 520, Issue 1-2, 2009, Pages 189-196

  Lim, S C V ^a   Rollett, A D ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

Composites; Dislocation density; Layered structures; Recrystallization texture; Roll bonding

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; GRAIN BOUNDARIES; GRAIN GROWTH; NIOBIUM ALLOYS;

CU LAYERS; CU-NB COMPOSITES; DISLOCATIONS DENSITIES; LAYERED STRUCTURES; LENGTH SCALE EFFECTS; PURE CU; RECRYSTALLISATION; RECRYSTALLIZATION TEXTURE; SUBMICRON; TEXTURE EVOLUTIONS;

RECRYSTALLIZATION (METALLURGY);

EID: 67651055953     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2009.05.020     Document Type: Article

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