Development of warpage and residual stresses in film insert molded parts

Polymer Engineering and Science

Volumn 49, Issue 7, 2009, Pages 1389-1399

  Oh, Hwa Jin ^a   Song, Young Seok ^b   Lee, Seung Hwan ^a   Youn, Jae Ryoun ^a  

^a Seoul National University   (South Korea)

^b Massachusetts Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING MOMENTS; HEATING;

BIOT NUMBER; EXPERIMENTAL AND NUMERICAL ANALYSIS; MOLDED PARTS; NONUNIFORM SHRINKAGE; ONE-DIMENSIONAL; RESIDUAL STRESSES DISTRIBUTIONS; TENSILE SPECIMENS; THERMALLY INDUCED; THERMOELASTIC MODELING; WARPAGES;

RESIDUAL STRESSES;

EID: 67650792480     PISSN: 00323888     EISSN: 15482634     Source Type: Journal    
DOI: 10.1002/pen.21354     Document Type: Article

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