Silver-copper electrodeposition from ammonium hydroxide solution: Influence of EDTA and HEDTA

Journal of Applied Electrochemistry

Volumn 39, Issue 8, 2009, Pages 1217-1227

  De Oliveira, G M ^a   Carlos, I A ^a  

^a FEDERAL UNIVERSITY OF SÃO CARLOS   (Brazil)

Author keywords

Additive; Alloy; Electrodeposition; Silver copper; Supersaturated solid solution

Indexed keywords

AMMONIUM HYDROXIDE SOLUTION; CODEPOSITION; COPPER ELECTRODEPOSITION; COPPER IONS; COPPER MORPHOLOGY; DENDRITIC GROWTH; DISODIUM SALT; DISPROPORTIONATION; EDS ANALYSIS; ENERGY DISPERSIVE X-RAY SPECTROSCOPY; ETHYLENE DIAMINE TETRA-ACETIC ACID; METALLIC COPPER; SILVER CONTENT; SUPERSATURATED SOLID SOLUTION; SUPERSATURATED SOLID SOLUTIONS; VOLTAMMETRIC STUDIES;

ACIDS; AMMONIUM COMPOUNDS; CHRONOAMPEROMETRY; COPPER; COPPER ALLOYS; COPPER SILVER DEPOSITS; CRYSTALLIZATION; DENDRIMERS; DEPOSITS; ELECTRODEPOSITION; IONS; METAL ANALYSIS; SCANNING ELECTRON MICROSCOPY; SOLID SOLUTIONS; SOLIDIFICATION; SULFUR COMPOUNDS; X RAY DIFFRACTION ANALYSIS;

SILVER ALLOYS;

EID: 67650554158     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10800-009-9777-6     Document Type: Article

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