Growth mechanism and stress relief patterns of Ni films deposited on silicone oil surfaces

Applied Surface Science

Volumn 255, Issue 20, 2009, Pages 8352-8358

  Cai, PingGen ^a,b   Yu, SenJiang ^c   Xu, XiaoJun ^a   Chen, MiaoGen ^c   Sui, ChengHua ^a   Ye, Gao Xiang ^c  

^a ZHEJIANG UNIVERSITY OF TECHNOLOGY   (China)

^b HOKKAIDO UNIVERSITY   (Japan)

^c ZHEJIANG UNIVERSITY   (China)

Author keywords

Crack; Liquid substrate; Stress pattern; Thin film growth

Indexed keywords

BUCKLING; CRACKS; SILICONES; STRESS RELIEF; THERMAL EVAPORATION; THIN FILMS;

BUCKLING OF PLATES; GROWTH MECHANISMS; GROWTH MODELING; LIQUID SUBSTRATE; RELIEF PATTERNS; STRESS PATTERNS; THERMAL EVAPORATION METHOD; VACUUM CHAMBERS;

FILM GROWTH;

EID: 67650494953     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2009.05.088     Document Type: Article

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