Evaluation of the thermal comfort of a thermoelectric ceiling cooling panel (TE-CCP) system

Journal of Electronic Materials

Volumn 38, Issue 7, 2009, Pages 1472-1477

  Lertsatitthanakorn, Charoenporn ^a   Wiset, Lamul ^a   Atthajariyakul, Surat ^a  

^a MAHASARAKHAM UNIVERSITY   (Thailand)

Author keywords

Cooling capacity; COP; Indoor air velocity; Indoor temperature

Indexed keywords

CIRCULATING COOLING WATER; COLD SIDE; COOLING CAPACITY; COOLING PANELS; COOLING PERFORMANCE; COP; CURRENT FLOWS; HEAT RELEASE; INDOOR AIR VELOCITY; INDOOR ENVIRONMENT; INDOOR TEMPERATURE; TEST CHAMBERS;

ALUMINA; ATMOSPHERIC TEMPERATURE; CEILINGS; COOLING WATER; SPACE HEATING; THERMAL COMFORT;

COOLING;

EID: 67650459468     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0637-7     Document Type: Conference Paper

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