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Volumn , Issue , 2009, Pages

Proposal of device capability profiling for manufacturing application service interface

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SERVICES; DEVICE DESCRIPTION; FIELD BUS TECHNOLOGY; MANUFACTURING APPLICATIONS; MANUFACTURING EQUIPMENT; PRODUCTION PLANNING AND SCHEDULING; PROFILING METHODS; SYSTEM INTEGRATION; XML SCHEMA DEFINITION LANGUAGE;

EID: 67650326693     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICIT.2009.4939689     Document Type: Conference Paper
Times cited : (1)

References (15)
  • 1
    • 67650344456 scopus 로고    scopus 로고
    • Association for Standardization of Automation and Measuring Systems ASAM, Generic Device Interface Version 4.3.3, 2007
    • Association for Standardization of Automation and Measuring Systems (ASAM), "Generic Device Interface Version 4.3.3", 2007.
  • 2
    • 0034855663 scopus 로고    scopus 로고
    • Dipl.-Ing. Rene Simon, Field device integration, ISIE2001, 2001.
    • Dipl.-Ing. Rene Simon, "Field device integration", ISIE2001, 2001.
  • 6
    • 67650335150 scopus 로고    scopus 로고
    • ISO15745-1, Industrial automation systems and integration - Open systems application integration framework Part1: Generic reference description, 2003.
    • ISO15745-1, "Industrial automation systems and integration - Open systems application integration framework Part1: Generic reference description", 2003.
  • 7
    • 56749186235 scopus 로고    scopus 로고
    • Daniel Grossmann, OPC UA based Field device integration, SICE2008, 2008.
    • Daniel Grossmann, "OPC UA based Field device integration, SICE2008, 2008.
  • 8
    • 51949108533 scopus 로고    scopus 로고
    • Research on OPC UA based on Electronic Device Description
    • Huang, Renjie, "Research on OPC UA based on Electronic Device Description", ICIEA 2008, 2008.
    • (2008) ICIEA , pp. 2008
    • Huang, R.1
  • 9
    • 38949122520 scopus 로고    scopus 로고
    • Function blocks (FB) for process control - Part 3: Electric Device Description Language (EDDL)
    • IEC 61804-3
    • IEC 61804-3, "Function blocks (FB) for process control - Part 3: Electric Device Description Language (EDDL)", 2006.
    • (2006)
  • 10
    • 67650343720 scopus 로고    scopus 로고
    • TC184/SC5, "Industrial automation systems and integration - Service interface for testing applications Part4: Device capability profile template",
    • ISO/ ISO/CD 20242-4
    • ISO/TC184/SC5, "Industrial automation systems and integration - Service interface for testing applications Part4: Device capability profile template", ISO/CD 20242-4, 2007.
    • (2007)
  • 11
    • 67650335692 scopus 로고    scopus 로고
    • OASIS PPS-1, Production Planning and Scheduling Part 1: Core Elements CD 01 rev10, Sep 20th, 2006.
    • OASIS PPS-1, "Production Planning and Scheduling Part 1: Core Elements CD 01 rev10", Sep 20th, 2006.
  • 12
    • 67650344594 scopus 로고    scopus 로고
    • OASIS PPS-2, Production Planning and Scheduling Part 2: Transaction Messages WD 14, Sep 20th, 2006
    • OASIS PPS-2, "Production Planning and Scheduling Part 2: Transaction Messages WD 14", Sep 20th, 2006
  • 13
    • 34250719223 scopus 로고    scopus 로고
    • Proposal of Manufacturing Equipment Capability Profiling and its Case Study
    • Oct
    • K. Suzuki, "Proposal of Manufacturing Equipment Capability Profiling and its Case Study", in Proc. SICEICASE 2006, Oct. 2006.
    • (2006) Proc. SICEICASE
    • Suzuki, K.1
  • 14
    • 67650335693 scopus 로고    scopus 로고
    • Methodology of Capability Profiling for Manufacturing Equipment, in Proc
    • Dec
    • K. Suzuki, "Methodology of Capability Profiling for Manufacturing Equipment", in Proc. IECON 2006, Dec. 2006.
    • (2006) IECON 2006
    • Suzuki, K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.