Correlation between simulation and experiment using UV curable gap fill materials for global planarization

International Journal of Nanoscience

Volumn 8, Issue 1-2, 2009, Pages 103-106

  Takei, Satoshi ^a   Yoon, Sangwoong ^a   Ohashi, Tomoya ^a   Horiguchi, Yusuke ^a   Nakajima, Yasuyuki ^a   Lin, Michael W ^b   Willson, C Grant ^b  

^a NISSAN CHEMICAL INDUSTRIES LTD   (Japan)

^b The University of Texas at Austin   (United States)

Author keywords

Lithography; Nanoimprinting; Outgas; Planarization; Resist poisoning; Simulation; UV curable material

Indexed keywords

CURING; DRY ETCHING; LITHOGRAPHY; NANOIMPRINT LITHOGRAPHY; SUBSTRATES; TOPOGRAPHY;

NANO-IMPRINTING; OUTGAS; PLANARIZATION; SIMULATION; UV CURABLE;

DIELECTRIC MATERIALS;

EID: 67650075037     PISSN: 0219581X     EISSN: None     Source Type: Journal    
DOI: 10.1142/s0219581x09005840     Document Type: Conference Paper

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