Effect of the evolution of phenol-formaldehyde resin on the high-temperature bonding

International Journal of Adhesion and Adhesives

Volumn 29, Issue 7, 2009, Pages 718-723

  Wang, Jigang ^a   Jiang, Nan ^b   Jiang, Haiyun ^a,c  

^a SOUTHEAST UNIVERSITY   (China)

^b NANJING UNIVERSITY   (China)

^c NANJING INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Ceramics; Degradation; High temperature adhesives; Phenol formaldehyde resin

Indexed keywords

BONDING PROPERTY; CERAMICS; ELEMENTAL SILICON; GRAPHITE JOINTS; GRAPHITE SUBSTRATE; HIGH TEMPERATURE; HIGH-TEMPERATURE ADHESIVES; MATRIX; MECHANICAL STRENGTH; MODIFICATION EFFECT; ORGANIC RESINS; PHENOL-FORMALDEHYDE; PHENOL-FORMALDEHYDE RESIN; RESIN MATRIX; VOLUME SHRINKAGE;

ADHESIVES; BIODEGRADATION; BONDING; BORON; BORON CARBIDE; CERAMIC MATERIALS; DEGRADATION; FORMALDEHYDE; GRAPHITE; PHENOLS; RESINS;

PHENOLIC RESINS;

EID: 67649887332     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2009.03.001     Document Type: Article

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