Dimensional considerations in achieving large quality factors for resonant silicon cantilevers in air

Journal of Applied Physics

Volumn 105, Issue 1, 2009, Pages

  Naeli, Kianoush ^a   Brand, Oliver ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR DAMPING; DAMPING MECHANISMS; DAMPING MODEL; EXPERIMENTAL DATA; EXPERIMENTAL DATA ACQUISITION; GEOMETRICAL DIMENSIONS; MODIFIED MODEL; OPTIMUM LENGTH; Q-FACTORS; QUALITY FACTORS; RESONANCE CHARACTERISTIC; RESONANCE MODE; RESONANT CANTILEVER; SILICON CANTILEVER; SILICON CANTILEVER BEAM; SUPPORT LOSS; THERMOELASTIC DAMPING;

ATMOSPHERIC PRESSURE; ATOMIC FORCE MICROSCOPY; BANDPASS FILTERS; CANTILEVER BEAMS; DAMPING; Q FACTOR MEASUREMENT; RESONANCE; THERMOELASTICITY;

NANOCANTILEVERS;

EID: 67649763918     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3062204     Document Type: Article

References (46)

1. T. Thundat, E. A. Wachter, S. L. Sharp, and R. J. Warmack, Appl. Phys. Lett. 0003-6951 10.1063/1.113896 66, 1695 (1995).
2. A. Boisen, J. Thaysen, H. Jensenius, and O. Hansen, Ultramicroscopy 0304-3991 10.1016/S0304-3991(99)00148-5 82, 11 (2000).
3. D. Lange, C. Hagleitner, A. Hierlemann, O. Brand, and H. Baltes, Anal. Chem. 0003-2700 10.1021/ac011269j 74, 3084 (2002).
4. N. V. Lavrik, M. J. Sepaniak, and P. G. Datskos, Rev. Sci. Instrum. 0034-6748 10.1063/1.1763252 75, 2229 (2004).
5. Y. Xu, J. T. Lin, B. W. Alphenaar, and R. S. Keynton, Appl. Phys. Lett. 0003-6951 10.1063/1.2193347 88, 143513 (2006).
6. W. H. King, Anal. Chem. 0003-2700 10.1021/ac60215a012 36, 1735 (1964).
7. J. P. Cleveland, S. Manne, D. Bocek, and P. K. Hansma, Rev. Sci. Instrum. 0034-6748 10.1063/1.1144209 64, 403 (1993).
8. M. Li, H. X. Tang, and M. L. Roukes, Nat. Nanotechnol. 1748-3387 10.1038/nnano.2006.208 2, 114 (2007).
9. J. R. Vig and F. L. Walls, in Proceedings of the 2000 IEEE/EIA International Frequency Control Symposium and Exhibition, Kansas City, MO, 2000, p. 30-3.
10. L. Rodriguez-Pardo, J. F. Rodriguez, C. Gabrielli, and R. Brendel, IEEE Sens. J. 1530-437X 10.1109/JSEN.2005.859257 5, 1251 (2005).
11. A. N. Cleland and M. L. Roukes, J. Appl. Phys. 0021-8979 10.1063/1.1499745 92, 2758 (2002).
12. M. B. Viani, T. E. Schaffer, A. Chand, M. Rief, H. E. Gaub, and P. K. Hansma, J. Appl. Phys. 0021-8979 10.1063/1.371039 86, 2258 (1999).
13. J. A. Sidles and D. Rugar, Phys. Rev. Lett. 0031-9007 10.1103/PhysRevLett.70.3506 70, 3506 (1993).
14. W. Jing, J. E. Butler, D. S. Y. Hsu, and T. C. Nguyen, in Technical Digest. MEMS 2002 IEEE International Conference, Las Vegas, NV, 2002, p. 657-60.
15. F. R. Blom, S. Bouwstra, M. Elwenspoek, and J. H. J. Fluitman, J. Vac. Sci. Technol. B 1071-1023 10.1116/1.586300 10, 19 (1992).
16. J. W. M. Chon, P. Mulvaney, and J. E. Sader, J. Appl. Phys. 0021-8979 10.1063/1.372455 87, 3978 (2000).
17. W. E. Baker, W. E. Woolam, and D. Young, Int. J. Mech. Sci. 0020-7403 10.1016/0020-7403(67)90032-X 9, 743 (1967).
18. S. A. L. Glegg, J. Sound Vib. 0022-460X 10.1016/0022-460X(83)90512-6 87, 637 (1983).
19. G. R. Torr, Am. J. Phys. 0002-9505 10.1119/1.13625 52, 402 (1984).
20. M. C. Cross and R. Lifshitz, Phys. Rev. B 0163-1829 10.1103/PhysRevB.64. 085324 64, 085324 (2001).
21. C. Zener, Phys. Rev. 53, 90 (1938).
22. R. Lifshitz and M. L. Roukes, Phys. Rev. B 0163-1829 10.1103/PhysRevB.61. 5600 61, 5600 (2000).
23. S. Reid, G. Cagnoli, D. R. M. Crooks, J. Hough, P. Murray, S. Rowan, M. M. Fejer, R. Route, and S. Zappe, Phys. Lett. A 351, 205 (2006). 0375-9601
24. V. B. Braginsky, Systems with Small Dissipation (University of Chicago Press, Chicago, 1985).
25. J. Yang, T. Ono, and M. Esashi, J. Microelectromech. Syst. 1057-7157 10.1109/JMEMS.2002.805208 11, 775 (2002).
26. K. Y. Yasumura, T. D. Stowe, E. M. Chow, T. Pfafman, T. W. Kenny, B. C. Stipe, and D. Rugar, J. Microelectromech. Syst. 1057-7157 10.1109/84.825786 9, 117 (2000).
27. Z. L. Hao, A. Erbil, and F. Ayazi, Sens. Actuators, A 0924-4247 10.1016/j.sna.2003.09.037 109, 156 (2003).
28. W. E. Newell, Science 0036-8075 10.1126/science.161.3848.1320 161, 1320 (1968).
29. K. Kokubun, M. Hirata, H. Murakami, Y. Toda, and M. Ono, Vacuum 0042-207X 10.1016/0042-207X(84)90318-X 34, 731 (1984).
30. J. E. Sader, J. Appl. Phys. 0021-8979 10.1063/1.368002 84, 64 (1998).
31. L. D. Landau and E. M. Lifshitz, Fluid Mechanics, 2nd ed. (Elsevier, New York, 2004).
32. K. Yum, Z. Wang, A. P. Suryavanshi, and M. -F. Yu, J. Appl. Phys. 0021-8979 10.1063/1.1787912 96, 3933 (2004).
33. K. Kokubun, M. Hirata, M. Ono, H. Murakami, and Y. Toda, J. Vac. Sci. Technol. A 0734-2101 10.1116/1.574869 5, 2450 (1987).
34. G. Y. Chen, R. J. Warmack, T. Thundat, D. P. Allison, and A. Huang, Rev. Sci. Instrum. 0034-6748 10.1063/1.1144647 65, 2532 (1994).
35. H. Hosaka, K. Itao, and S. Kuroda, Sens. Actuators, A 0924-4247 10.1016/0924-4247(95)01003-J 49, 87 (1995).
36. D. A. Walters, J. P. Cleveland, N. H. Thomson, P. K. Hansma, M. A. Wendman, G. Gurley, and V. Elings, Rev. Sci. Instrum. 0034-6748 10.1063/1.1147177 67, 3583 (1996).
37. P. I. Oden, G. Y. Chen, R. A. Steele, R. J. Warmack, and T. Thundat, Appl. Phys. Lett. 0003-6951 10.1063/1.116626 68, 3814 (1996).
38. D. W. Stauff and D. J. Montgomery, J. Appl. Phys. 0021-8979 10.1063/1.1722035 26, 540 (1955).
39. S. Kirstein, M. Mertesdorf, and M. Schonhoff, J. Appl. Phys. 0021-8979 10.1063/1.368335 84, 1782 (1998).
40. T. Ikehara, J. Lu, M. Konno, R. Maeda, and T. Mihara, J. Micromech. Microeng. 0960-1317 10.1088/0960-1317/17/12/015 17, 2491 (2007).
41. L. Rosenhead, Laminar Boundary Layers: An Account of the Development, Structure, and Stability of Laminar Boundary Layers in Incompressible Fluids, Together with a Description of the Associated Experimental Techniques (Clarendon, Oxford, 1963).
42. D. M. Photiadis and J. A. Judge, Appl. Phys. Lett. 0003-6951 10.1063/1.1773928 85, 482 (2004).
43. A. Duwel, R. N. Candler, T. W. Kenny, and M. Varghese, J. Microelectromech. Syst. 1057-7157 10.1109/JMEMS.2006.883573 15, 1437 (2006).
44. K. Naeli, P. Tandon, and O. Brand, in Solid-State Sensors, Actuators and Microsystems Conference, Lyon, France, 2007, pp. 245-248.
45. S. Timoshenko, D. H. Young, and W. Weaver, Vibration Problems in Engineering, 4th ed. (Wiley, New York, 1974).
46. A. Nathan and H. Baltes, Microtransducer CAD: Physical and Computational Aspects (Springer, New York, 1999).