Analysis of mixed adhesive bonded joints part II: Parametric study

Journal of Adhesion Science and Technology

Volumn 23, Issue 1, 2009, Pages 35-61

  Das Neves, Paulo J C ^a   Da Silva, Lucas F M ^a   Adams, R D ^b  

^a UNIVERSITY OF PORTO   (Portugal)

^b UNIVERSITY OF BRISTOL   (United Kingdom)

Author keywords

Adhesive lap joints; Analytical model; Mixed adhesive joints; Parametric study

Indexed keywords

ADHERENDS; ADHESIVE BONDED JOINTS; ANALYTICAL MODEL; DOUBLE LAP JOINT; FINITE ELEMENT ANALYSIS; HIGH TEMPERATURE; HIGH-TEMPERATURE ADHESIVES; LOW TEMPERATURES; LOW-TEMPERATURE ADHESIVES; LOW-TO-HIGH; MIXED ADHESIVE JOINTS; OVERLAP LENGTH; PARAMETRIC STUDY; PEEL STRESS; SINGLE LAP JOINTS; TEMPERATURE VARIATION; THEORETICAL FORMULATION; YOUNG'S MODULUS;

ADHESIVE JOINTS; ADHESIVES; COMPUTER SIMULATION; ELASTIC MODULI; ELASTICITY; HIGH TEMPERATURE APPLICATIONS; STRESS CONCENTRATION; THERMAL EFFECTS; TITANIUM;

FINITE ELEMENT METHOD;

EID: 67649693391     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856108X336035     Document Type: Article

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