-
1
-
-
0029427666
-
Enhancing thermal conductivity of fluids with nanoparticles
-
San Francisco, CA, Nov 12-17, American Society of Mechanical Engineers: New York
-
Choi, S. U. S. Enhancing thermal conductivity of fluids with nanoparticles. In Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition, San Francisco, CA, Nov 12-17, 1995; American Society of Mechanical Engineers: New York, 1995; Vol. 231, pp 99-105.
-
(1995)
Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition
, vol.231
, pp. 99-105
-
-
Choi, S.U.S.1
-
2
-
-
40649115383
-
-
Li, X. F.; Zhu, D. S.; Wang, X. J.; Gao, J. W.; Li, H. Thermochim. Acta 2008, 469, 98.
-
(2008)
Thermochim. Acta
, vol.469
, pp. 98
-
-
Li, X.F.1
Zhu, D.S.2
Wang, X.J.3
Gao, J.W.4
Li, H.5
-
3
-
-
37749004290
-
-
Timofeeva, E. V.; Gavrilov, A. N.; McCloskey, J. M.; Tolmachev, Y. V. Phys. Rev. E 2007, 76, 061203.
-
(2007)
Phys. Rev. E
, vol.76
, pp. 061203
-
-
Timofeeva, E.V.1
Gavrilov, A.N.2
McCloskey, J.M.3
Tolmachev, Y.V.4
-
4
-
-
33751548882
-
-
Boston, Dec 2-6, Materials Research Society: Pittsburgh, 1996
-
Eastman, J. A.; Choi, U. S.; Li, S.; Thompson, L. J.; Lee, S. 1996 Fall Meeting of the Materials Research Society, Boston, Dec 2-6, 1996; Materials Research Society: Pittsburgh, 1996; p 1.
-
(1996)
Fall Meeting of the Materials Research Society
, pp. 1
-
-
Eastman, J.A.1
Choi, U.S.2
Li, S.3
Thompson, L.J.4
Lee, S.5
-
5
-
-
67649138444
-
-
Eastman, J. A.; Phillpot, S. R.; Choi, S. U. S.; Keblinski, P. Annu. Rev. Mater. Res. 2004, 34, 6.
-
(2004)
Annu. Rev. Mater. Res
, vol.34
, pp. 6
-
-
Eastman, J.A.1
Phillpot, S.R.2
Choi, S.U.S.3
Keblinski, P.4
-
6
-
-
18844419456
-
-
Keblinski, P.; Eastman, J. A.; Cahill, D. G. Mater. Today 2005, 8, 36.
-
(2005)
Mater. Today
, vol.8
, pp. 36
-
-
Keblinski, P.1
Eastman, J.A.2
Cahill, D.G.3
-
7
-
-
33645407639
-
-
Krishnamurthy, S.; Bhattacharya, P.; Phelan, P. E. Nano Lett. 2006, 6, 419.
-
(2006)
Nano Lett
, vol.6
, pp. 419
-
-
Krishnamurthy, S.1
Bhattacharya, P.2
Phelan, P.E.3
-
8
-
-
36249016229
-
-
Philip, J.; Shima, P. D.; Raj, B. Appl. Phys. Lett. 2007, 91, 203108.
-
(2007)
Appl. Phys. Lett
, vol.91
, pp. 203108
-
-
Philip, J.1
Shima, P.D.2
Raj, B.3
-
9
-
-
0032825295
-
-
Lee, S.; Choi, S. U. S.; Li, S.; Eastman, J. A. J. Heat Transfer 1999, 121, 280.
-
(1999)
J. Heat Transfer
, vol.121
, pp. 280
-
-
Lee, S.1
Choi, S.U.S.2
Li, S.3
Eastman, J.A.4
-
10
-
-
4243183090
-
-
Grenoble, France, August
-
Li, Q.; Xuan, Y. In Proceedings of the 12th International Heat Transfer Conference, Grenoble, France, August 2002; p 483.
-
(2002)
Proceedings of the 12th International Heat Transfer Conference
, pp. 483
-
-
Li, Q.1
Xuan, Y.2
-
11
-
-
14744281545
-
-
Murshed, S. M. S.; Leong, K. C.; Yang, C. Int. J. Therm. Sci. 2005, 44, 367.
-
(2005)
Int. J. Therm. Sci
, vol.44
, pp. 367
-
-
Murshed, S.M.S.1
Leong, K.C.2
Yang, C.3
-
12
-
-
30944440044
-
-
Liu, M. S.; Lin, M. C.-C; Huang, I.-T.; Wang, C.-C. Chem. Eng. Technol. 2006, 29, 72.
-
(2006)
Chem. Eng. Technol
, vol.29
, pp. 72
-
-
Liu, M.S.1
Lin, M.C.-C.2
Huang, I.-T.3
Wang, C.-C.4
-
13
-
-
14744281545
-
-
Murshed, S. M. S.; Leong, K. C.; Yang, C. Int. J. Therm. Sci. 2005, 44, 367.
-
(2005)
Int. J. Therm. Sci
, vol.44
, pp. 367
-
-
Murshed, S.M.S.1
Leong, K.C.2
Yang, C.3
-
15
-
-
34247544650
-
-
Li, X. F.; Zhu, D. S.; Wang, X. J. J. Colloid Interface Sci. 2007, 310, 456.
-
(2007)
J. Colloid Interface Sci
, vol.310
, pp. 456
-
-
Li, X.F.1
Zhu, D.S.2
Wang, X.J.3
-
16
-
-
33847407147
-
-
Hwang, Y.; Lee, J. K.; Lee, C. H.; Jung, Y. M.; Cheong, S. I.; Lee, C. G.; Ku, B. C.; Jang, S. P. Thermochim. Acta 2007, 455, 70.
-
(2007)
Thermochim. Acta
, vol.455
, pp. 70
-
-
Hwang, Y.1
Lee, J.K.2
Lee, C.H.3
Jung, Y.M.4
Cheong, S.I.5
Lee, C.G.6
Ku, B.C.7
Jang, S.P.8
-
17
-
-
33645667882
-
-
Lee, D.; Kim, J. W.; Kim, B. G. J. Phys. Chem. B 2006, 110, 4323.
-
(2006)
J. Phys. Chem. B
, vol.110
, pp. 4323
-
-
Lee, D.1
Kim, J.W.2
Kim, B.G.3
-
18
-
-
0037383054
-
-
Jiang, L.; Gao, L.; Sun, J. J. Colloid Interface Sci. 2003, 260, 89.
-
(2003)
J. Colloid Interface Sci
, vol.260
, pp. 89
-
-
Jiang, L.1
Gao, L.2
Sun, J.3
-
19
-
-
15544375926
-
-
O'Cornell, M. J.; Bachilo, S. M.; Huffman, C. B.; Moore, V. C.; Strano, M. S.; Haroz, E. H.; Rialon, K. L.; Boul, P. J.; Noon, W. H.; Kittrell, C.; Ma, J.; Hauge, R. H.; Weisman, R. B.; Smalley, R. E. Science 2002, 297, 593.
-
(2002)
Science
, vol.297
, pp. 593
-
-
O'Cornell, M.J.1
Bachilo, S.M.2
Huffman, C.B.3
Moore, V.C.4
Strano, M.S.5
Haroz, E.H.6
Rialon, K.L.7
Boul, P.J.8
Noon, W.H.9
Kittrell, C.10
Ma, J.11
Hauge, R.H.12
Weisman, R.B.13
Smalley, R.E.14
-
20
-
-
67649138443
-
-
Rodriguez-Prez, M. A.; Reglero, J. A.; Lehmhus, D.; Wichmann, W.; de Saja, J. A.; Fernandez, A. The transient plane source technique (TPS) to measure thermal conductivity and its potential as a tool to detect in-homogeneities in metal foams. In Proceedings of the International Conference Advanced Metallic Materials, Smolenice, Slovakia, Nov 5-7, 2003; pp 253-257.
-
Rodriguez-Prez, M. A.; Reglero, J. A.; Lehmhus, D.; Wichmann, W.; de Saja, J. A.; Fernandez, A. The transient plane source technique (TPS) to measure thermal conductivity and its potential as a tool to detect in-homogeneities in metal foams. In Proceedings of the International Conference "Advanced Metallic Materials", Smolenice, Slovakia, Nov 5-7, 2003; pp 253-257.
-
-
-
-
22
-
-
33847226236
-
-
Studart, A. R.; Amstad, E.; Gauckler, L. J. Langmuir 2007, 23, 1081.
-
(2007)
Langmuir
, vol.23
, pp. 1081
-
-
Studart, A.R.1
Amstad, E.2
Gauckler, L.J.3
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