ElectroBond improves immediate dentin microtensile bond strength of two etch-and-rinse adhesives

Journal of Adhesive Dentistry

Volumn 11, Issue 1, 2009, Pages 27-33

  Mazzoni, Annalisa ^a   Visintini, Erika ^b   Vita, Francesca ^b   Pasquantonio, Guido ^c   Saboia, Vicente P A ^d   Ruggeri, Alessandra ^a   Di Lenarda, Roberto ^b   Dorigo, Elettra ^b   Breschi, Lorenzo ^b,e  

^a UNIVERSITY OF BOLOGNA   (Italy)

^b UNIVERSITY OF TRIESTE   (Italy)

^c UNIVERSITY OF ROME TOR VERGATA   (Italy)

^d FEDERAL UNIVERSITY OF CEARÁ   (Brazil)

^e CNR   (Italy)

Author keywords

Dentin; Dentin bonding systems; Electric current; Microtensile; TEM

Indexed keywords

DENTIN BONDING AGENT; RESIN; RESIN CEMENT; XP BOND; XP-BOND;

ARTICLE; CHEMISTRY; CLASSIFICATION; COMPARATIVE STUDY; DENTAL ACID ETCHING; DENTAL BONDING; DENTIN; ELECTROCHEMICAL ANALYSIS; HUMAN; MATERIALS TESTING; MECHANICAL STRESS; METHODOLOGY; SCOTCHBOND; SILVER STAINING; SINGLE BLIND PROCEDURE; SURFACE PROPERTY; TENSILE STRENGTH; TOOTH DISEASE; TRANSMISSION ELECTRON MICROSCOPY; ULTRASTRUCTURE;

ACID ETCHING, DENTAL; COMPOSITE RESINS; DENTAL BONDING; DENTAL LEAKAGE; DENTIN; DENTIN-BONDING AGENTS; ELECTROCHEMICAL TECHNIQUES; HUMANS; MATERIALS TESTING; MICROSCOPY, ELECTRON, TRANSMISSION; RESIN CEMENTS; SILVER STAINING; SINGLE-BLIND METHOD; STRESS, MECHANICAL; SURFACE PROPERTIES; TENSILE STRENGTH;

EID: 67649213494     PISSN: 14615185     EISSN: 17579988     Source Type: Journal    
DOI: 10.3290/j.jad.a14729     Document Type: Article

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