Direct electroless nickel plating on copper circuits using DMAB as a second reducing agent

2nd 1998 IEMT/IMC Symposium

Volumn 1998-April, Issue , 1998, Pages 149-153

  Watanabe, H ^a   Honma, H ^b  

^a Faculty of Engineering   (Japan)

^b KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSTS; CATALYTIC OXIDATION; COPPER; MICROELECTRONICS; NICKEL COMPOUNDS; NICKEL DEPOSITS; NICKEL PLATING; PALLADIUM; PHOSPHORUS COMPOUNDS; TIMING CIRCUITS;

CIRCUIT BOARDS; COPPER PATTERN; DIMETHYLAMINES; ELECTROLESS NI-P PLATING; ELECTROLESS NICKEL; ELECTROLESS NICKEL PLATING; NICKEL DEPOSITION; PALLADIUM CATALYST;

COPPER DEPOSITS;

EID: 67349256027     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMTIM.1998.704543     Document Type: Conference Paper

References (5)

1. Masaru Kato, Keiko Niikura, Shigetaka Hoshino and Izumi Ohno, " Electrochemical Behavior of Electroless Gold Plating with Ascorbic Acid as a Reducing Agent" J. Surf. Finish. Soc. of Japan, vol. 42, pp. 69-75, July 1991
2. Hideto Watanabe, Yasushi Igarashi and Hideo Honma, " Electroless Nickel Plating on Copper Fine Patterns by Selective Activation Process " JIPC, vol. 12, pp. 29-33, January 1997
3. Izumi Ohno, Osamu Wakabayashi and Shiro Haruyama, " Anodic Oxidation of Reductants in Electroless Plating" J. Electrochem. Soc, vol. 132, pp. 2323-2330, October 1985
4. Hideo Honma and Tomoyuki Fujinami, Uniformity of Electroless Copper Deposition" J. Surf. Finish. Soc. of Japan, vol. 42, pp. 76-79 July 1991
5. Jan W. M. Jacobs and Jan M. G. Rikken, Oxygen-Diffusion-Size Effect in Eletroless Metal Deposition" J. Electrochem. Soc, vol. 135 pp. 2822-2827, November 1988