The effects of different architectures on thermal fatigue in particle reinforced MMC for heat sink applications

Advanced Materials Research

Volumn 59, Issue , 2009, Pages 177-181

  Schobel M ^a   Fiedler, G ^a   Degischer, H P ^a   Altendorfer, W ^a   Vaucher, S ^b  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^b SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

MMC; Reinforcement architecture; Synchrotron tomography; Thermal fatigue; Void kinetics

Indexed keywords

AL-SIC MMC; BASEPLATE; DIAMOND PARTICLES; ELECTRONIC MODULES; HEAT SINK APPLICATIONS; HIGH THERMAL CONDUCTIVITY; IN-SITU SYNCHROTRONS; LOW COEFFICIENT OF THERMAL EXPANSIONS; MATRIX; MMC; PARTICLE REINFORCED; PARTICLE REINFORCED METAL MATRIX COMPOSITES; POWER ELECTRONIC DEVICES; SIC PARTICLES; SYNCHROTRON TOMOGRAPHY; THERMAL MANAGEMENT; VOID KINETICS; VOLUME CONTENT;

ACTIVE FILTERS; BIPOLAR TRANSISTORS; ELECTRIC POWER SYSTEMS; FATIGUE DAMAGE; HEAT SINKS; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); METALLIC MATRIX COMPOSITES; REINFORCEMENT; SILICON CARBIDE; SYNCHROTRONS; THERMAL CONDUCTIVITY; THERMAL FATIGUE; THERMOANALYSIS; TOMOGRAPHY;

THERMAL EXPANSION;

EID: 67349206494     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/3-908454-01-8.177     Document Type: Conference Paper

References (7)

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