Passivation behaviour of structurally relaxed Zr48Cu36Ag8Al8 metallic glass

Journal of Alloys and Compounds

Volumn 479, Issue 1-2, 2009, Pages 257-261

  Jayaraj, J ^a   Gebert, A ^a   Schultz, L ^a  

^a IFW DRESDEN   (Germany)

Author keywords

Corrosion; Electrochemical reactions; Metallic glasses; Rapid solidification

Indexed keywords

ACTIVE DISSOLUTIONS; ELECTROCHEMICAL REACTIONS; FREE-VOLUME; GLASSY ALLOYS; HIGH ENERGIES; META-STABLE STATE; PASSIVE TRANSITIONS;

ALLOYS; ALUMINUM; COPPER ALLOYS; CRYSTALLIZATION; DISSOLUTION; ELECTROCHEMICAL CORROSION; GLASS; LIQUID METALS; PASSIVATION; RAPID SOLIDIFICATION; SILVER; SILVER ALLOYS; ZIRCONIUM;

METALLIC GLASS;

EID: 67349171067     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.01.056     Document Type: Article

References (25)

1. Scully J.R., Gebert A., and Payer J.H. J. Mater. Res. 22 (2007) 302
2. Gebert A., Buchholz K., Leonhard A., Mummert K., Eckert J., and Schultz L. Mater. Sci. Eng. A 267 (1999) 294
3. Gebert A., Buchholz K., El-Aziz A.M., and Eckert J. Mater. Sci. Eng. A 316 (2001) 60
4. Kamachi Mudali U., Baunack S., Eckert J., Schultz L., and Gebert A. J. Alloys Compd. 377 (2004) 290
5. Raju V.R., Kühn U., Wolff U., Schneider F., Eckert J., Reiche R., and Gebert A. Mater. Lett. 57 (2002) 173
6. Liu L., Qiu C.L., Zou H., and Chan K.C. J. Alloys Compd. 399 (2005) 144
7. Fleury E., Jayaraj J., Kim Y.C., Seok H.K., Kim K.Y., and Kim K.B. J. Power Sources 159 (2006) 34
8. Jayaraj J., Kim Y.C., Seok H.K., Kim K.B., and Fleury E. Mater. Sci. Eng. A 449 (2007) 30
9. Inoue A., Shimizu T., Yamaura S.I., Fujita Y., Takagi S., and Kimura H. Mater. Trans. 46 (2005) 1706
10. Hiromoto S., Asami K., Tsai A.-P., Sumita M., and Hanawa T. J. Electrochem. Soc. 149 (2002) B117
11. Qiu C.L., Chen Q., Liu L., Chan K.C., Zhou J.X., Chen P.P., and Zhang S.M. Scripta Mater. 55 (2006) 605
12. Latanision R.M., Turn J.C., and Compeau C.R. In: Miller K.J., and Smith R.F. (Eds). Proceedings of the 3rd International Conference on Mechanical Behavior of Materials (ICM3) vol. 2 (1980), Pergamon Press, Oxford, UK
13. Bernal J.D. Nature 183 (1959) 141
14. Bernal J.D. Nature 185 (1960) 68
15. Spaepen F. In: Balian R. (Ed). Les Houches, Session XXXV, 1980-Physics of Defects (1981), North-Holland, Amsterdam 135
16. Taub A.I., and Spaepen F. Acta Metall. 28 (1980) 1781-1788
17. Chen H.S., Kimerling L.C., Poate J.M., and Brown W.L. Appl. Phys. Lett. 32 (1978) 461
18. Flores K.M., Suh D., Howell R., Asoka-Kumar P., Sterne P.A., and Dauskardt R.H. Mater. Trans. 42 (2001) 619
19. Jiang W.H., Jiang F., Green B.A., Liu F.X., Liaw P.K., Choo H., and Qiu K.Q. Appl. Phys. Lett. 91 (2007) 041904
20. Zhang Q.S., Zhang W., and Inoue A. Mater. Trans. 48 (2007) 627
21. Yavari A.R., Moulec A.L., Inoue A., Nishiyama N., Lupu N., Matsubara E., Bolta W.J., Vaughan G., Michiel M.D., and Kvick A. Acta Mater. 53 (2005) 1611
22. Slipenyuk A., and Eckert J. Scripta Mater. 50 (2004) 39
23. Qin C.L., Zhang W., Zhang Q.S., Asami K., and Inoue A. J. Mater. Res. 23 (2008) 2091
24. Brett C.M.A., and Brett A.M. Electrochemistry: Principles, Methods and Application (1998), Oxford University Press
25. Private discussion with M. M Lohrengel, Institute for Physical Chemistry and Electrochemical, Heinrich-Heine University, Düsseldorf, Germany.