Electroless Sn-Ni alloy plating with high Sn content free of activation pretreatment

Journal of Alloys and Compounds

Volumn 477, Issue 1-2, 2009, Pages 328-332

  Kong, Yong ^a,b   Shao, Jianqun ^c   Wang, Wenchang ^a   Liu, Qifa ^a   Chen, Zhidong ^a,b  

^a CHANGZHOU UNIVERSITY   (China)

^b Key Laboratory of Fine Petrochemicals of Jiangsu Province   (China)

^c CAPITAL MEDICAL UNIVERSITY   (China)

Author keywords

Electroless plating; Free of activation; Sn content; Sn Ni alloy

Indexed keywords

ALLOY LAYERS; ANODIC POLARIZATION CURVES; COMPLEXING AGENTS; COPPER SUBSTRATES; ELECTROLESS; FREE OF ACTIVATION; PLATING BATHS; PLATING CONDITIONS; PLATING PROCESS; PRE TREATMENTS; RESISTANCE PROPERTIES; SN CONTENT; SN-NI ALLOY; SODIUM HYPOPHOSPHITES;

ALLOYS; CORROSION RESISTANCE; ELECTROLESS PLATING; ELECTROPLATING; LITHIUM BATTERIES; METAL CLADDING; NICKEL; SODIUM; THERMAL EFFECTS; THIOUREAS; TIN; UREA;

TIN ALLOYS;

EID: 67349129750     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.09.074     Document Type: Article

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