On thermomechanical properties of Au-Ag-Pd-Cu-Si bulk metallic glass

Materials Chemistry and Physics

Volumn 116, Issue 2-3, 2009, Pages 569-572

  Tang, T W ^a   Chang, Y C ^a   Huang, J C ^a   Gao, Q ^a   Jang, J S C ^b   Tsao, Chi Y A ^c  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b I SHOU UNIVERSITY   (Taiwan)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Amorphous materials; Thermal properties; Thermo mechanical analysis (TMA); Thermomechanical effects

Indexed keywords

ANTI-CORROSION; ANTI-OXIDATION; BULK METALLIC GLASS; MICRO ELECTRO MECHANICAL SYSTEM; MICRO FORMING; STRESS LEVELS; SUPERCOOLED LIQUID TEMPERATURE REGION; THERMAL PROPERTIES; THERMO-MECHANICAL ANALYSIS (TMA); THERMOMECHANICAL ANALYZERS; THERMOMECHANICAL EFFECTS; THERMOMECHANICAL PROPERTIES; VISCOSITY BEHAVIOR; VISCOSITY LEVEL; VISCOSITY VALUE; WORKING PRESSURES; WORKING TEMPERATURES;

GLASS; LIQUID METALS; MATERIALS PROPERTIES; MICROELECTROMECHANICAL DEVICES; PALLADIUM; SILVER; STRESSES; SUPERCOOLING; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOMECHANICAL TREATMENT; VISCOSITY;

METALLIC GLASS;

EID: 67349103428     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2009.04.032     Document Type: Article

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