Recovery of copper by LIX 984N-C from electroplating rinse bath solution

Hydrometallurgy

Volumn 98, Issue 1-2, 2009, Pages 86-91

  Kul, Mehmet ^a   Çetinkaya, Ümit ^a  

^a CUMHURIYET UNIVERSITY   (Turkey)

Author keywords

Copper electroplating 2nd rinse bath solution; Copper recovery; Solvent extraction

Indexed keywords

COPPER CONTENT; COPPER ELECTROPLATING; COPPER ELECTROPLATING 2ND RINSE BATH SOLUTION; COPPER RECOVERY; COPPER SULFATE; COUNTER CURRENT; FLOW SHEET; HYDROMETALLURGICAL PROCESS; LABORATORY SCALE; LIX 984; ORGANIC PHASE; PH VALUE; STRIPPING PROCESS; STRIPPING SOLUTION; TWO STAGE;

COPPER PLATING; DISSOLUTION; ELECTROPLATING; KEROSENE; SOLVENT EXTRACTION; SOLVENTS; STRIPPING (DYES); SULFURIC ACID;

COPPER;

EID: 67349099909     PISSN: 0304386X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.hydromet.2009.04.003     Document Type: Article

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