Applications of plasma-based technology to microelectronics and biomedical engineering

Surface and Coatings Technology

Volumn 203, Issue 17-18, 2009, Pages 2793-2798

  Chu, Paul K ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Biomaterials; Microelectronics; Plasma immersion ion implantation and Deposition; Silicon on insulator; Titanium oxide

Indexed keywords

ANTIBACTERIAL PROPERTIES; BULK SILICONS; BURIED INSULATORS; BURIED SILICON DIOXIDES; CUTTING LAYERS; DIAMOND-LIKE CARBONS; HIGH-SPEED; HYDROGEN ION IMPLANTATIONS; HYDROGEN PLASMAS; LATCH-UP; LOW-ENERGY PLASMAS; LOW-POWER; MICRO-ELECTRONIC DEVICES; NANO-STRUCTURED; NOVEL STRUCTURES; ORTHOPEDIC IMPLANTS; PARASITIC CAPACITANCES; PLASMA IMMERSION ION IMPLANTATION AND DEPOSITION; PLASMA-BASED ION IMPLANTATION AND DEPOSITIONS; PLASMA-BASED TECHNOLOGIES; RESEARCH ACTIVITIES; SELF-HEATING EFFECTS; SILICON DIOXIDES; SILICON-ON-INSULATOR; SOI STRUCTURES; SUB THRESHOLDS; SURFACE BIOACTIVITIES; SURFACE CHARACTERISTICS; THERMAL STABILITIES; THICK CERAMIC COATINGS;

APPLICATIONS; BIOCOMPATIBILITY; BIOLOGICAL MATERIALS; BIOMEDICAL ENGINEERING; CERAMIC COATINGS; ENGINEERING RESEARCH; HYDROGEN; HYDROGENATION; ION BOMBARDMENT; ION IMPLANTATION; MECHANICAL PROPERTIES; MICROELECTRONICS; MICROSENSORS; NANOSTRUCTURES; PHOSPHATE MINERALS; PLASMA DEPOSITION; PLASMA SPRAYING; PLASMAS; PROTECTIVE COATINGS; SILICA; SILICON ON INSULATOR TECHNOLOGY; SURFACES; THERMAL CONDUCTIVITY; THERMOANALYSIS; TITANIUM; TITANIUM OXIDES;

PLASMA STABILITY;

EID: 67349085757     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.02.131     Document Type: Article

References (36)

1. Streetman B.G., and Banerjee S. Solid State Electronic Devices. 5th Edition (2000), Prentice Hall, New Jersey
2. Redman-Whire W., Lee M.S.L., Tenbroek B.M., Uren M.J., and Bunyan R.J.T. Electron. Lett. 29 (1993) 1180
3. In: Anders A. (Ed). Handbook of Plasma Immersion Ion Implantation and Deposition (2000), Wiley, New York
4. Chu P.K., Chen J.Y., Wang L.P., and Huang N. Mater. Sci. Eng., R Rep. 36 (2002) 143
5. Chu P.K. Surf. Coat. Technol. 201 (2007) 5601
6. Colinge J.P. Silicon-on-Insulator Technology: Materials to VLSI (1991), Kluwer, Boston
7. Chu P.K. IEEE Circuits and Systems Magazine (2005) 16-27 Fourth Quarter
8. Zhu M., Chen P., Fu R.K.Y., An Z.H., Lin C.L., and Chu P.K. IEEE Trans. Electron Devices 51 (2004) 901
9. Zhu M., Chu P.K., Shi X., Wong M., Liu W.L., and Lin C.L. Appl. Phys. Lett. 85 (2004) 2532
10. Di Z.F., Huang A.P., Fu R.K.Y., Chu P.K., Shao L., Höchbauer T., Nastasi M., Zhang M., Liu W.L., Shen Q.W., Luo S.H., Song Z.T., and Lin C.L. J. Appl. Phys. 98 (2005) 053502
11. Di Z.F., Chu P.K., Zhu M., Fu R.K.Y., Luo S.H., Shao L., Nastasi M., Chen P., Alford T.L., Mayer J.W., Zhang M., Liu W.L., Song Z.T., and Lin C.L. Appl. Phys. Lett. 88 (2006) 142108
12. Chen P., Chu P.K., Höchbauer T., Lee J.-K., Nastasi M., Buca D., Mantl S., Loo R., Caymax M., Alford T., Mayer J.W., Theodore N.D., Cai M., Schmidt B., and Lau S.S. Appl. Phys. Lett. 86 (2005) 031904
13. Shao L., Lin Y., Lee J.K., Jia Q.X., Wang Y.Q., Nastasi M., Thompson P.E., Theodore N.D., Chu P.K., Alford T.L., Mayer J.W., Chen P., and Lau S.S. Appl. Phys. Lett. 87 (2005) 091902
14. Chen P., Lau S.S., Chu P.K., Henttinen K., Suni T., Suni I., Theodore N.D., Alford T., Mayer J.W., Shao L., and Nastasi M. Appl. Phys. Lett. 87 (2005) 111910
15. Chu P.K., Qin S., Chan C., Cheung N.W., and Larson L.A. Mater. Sci. Eng., R Rep. 17 (1996) 207
16. Kim H.M., Miyaji F., Kokubo T., Nishiguchi S., and Nakamura T. J. Biomed. Mater. Res. 45 (1999) 100
17. Moritz N., Jokinen M., Peltola T., Areva S., and Yli-Urpo A. J. Biomed. Mater. Res. 65A (2003) 9
18. Liu X., Fu R.K.Y., Poon R.W.Y., Chen P., Chu P.K., and Ding C. Biomaterials 25 (2004) 5575
19. Webster T.J., Ergun C., Doremus R.H., Siegel R.W., and Bizios R. Biomaterials 22 (2001) 1327
20. Keshmiri M., and Troczynski T. J. Non-cryst. Solids 324 (2003) 289
21. Peltola T., Jokinen M., Rahiala H., Ptsi M., Heikkilä J., Kangasniemi I., and Yli-Urpo A. J. Biomed. Mater. Res. 51 (2000) 200
22. Liu X.Y., Zhao X.B., Fu R.K.Y., Ho J.P.Y., Ding C.X., and Chu P.K. Biomaterials 26 (2005) 6143
23. Luyt A.S., Molefi J.A., and Krump H. Polym. Degrad. Stab. 91 (2006) 1629
24. Middleton J.C., and Tipton A.J. Biomaterials 21 (2000) 2335
25. Lamba N.M.K., Courtney J.M., Gaylor J.D.S., and Lowe G.D.O. Biomaterials 21 (2000) 89
26. An Y.H., and Friedman R.J. J. Biomed. Mater. Res. 43 (1998) 338
27. Beech I.B., Smith J.R., and Steele A.A. Colloids Surf., B Biointerfaces 23 (2002) 231
28. Thome J., Holländer A., Jaeger W., Trick I., and Oehr C. Surf. Coat. Technol. 174-175 (2003) 584
29. Dowling D.P., Betts A.J., Pope C., McConnell M.L., Eloy R., and Arnaud M.N. Surf. Coat. Technol. 163-164 (2003) 637
30. Kalyon B.D., and Olgun U. Am. J. Infect. Control 29 (2001) 124
31. Fu R.K.Y., Cheung I.T.L., Mei Y.F., Shek C.H., Siu G.G., Chu P.K., Yang W.M., Leng Y.X., Huang Y.X., Tian X.B., and Yang S.Q. Nucl. Instrum. Methods Phys. Res., B Beam Interact. Mater. Atoms 237 (2005) 417
32. Zhang W., Chu P.K., Ji J.H., and Zhang Y.H. Appl. Surf. Sci. 252 (2006) 7884
33. Zhang W., Zhang Y.H., Ji J.H., Zhao J., Chu P.K., and Yan Q. Polymer 47 (2006) 7441
34. Zhang W., Chu P.K., Ji J.H., Zhang Y.H., and Yan Q. Biomaterials 27 (2006) 44
35. Zhang W., Ji J.H., Zhang Y.H., Yan Q., Kurmaev E.Z., Moewes A., Zhao J., and Chu P.K. Appl. Surf. Sci. 253 (2007) 8981
36. Zhang W., Ji J.H., Zhang Y.H., Yan Q., and Chu P.K. Plasma Processes Polym. 4 (2007) 158