Environmental stress testing of electro-optic polymer modulators

Journal of Lightwave Technology

Volumn 27, Issue 11, 2009, Pages 1527-1532

  Dinu, Raluca ^a   Jin, Dan ^a   Yu, Guomin ^a   Chen, Baoquan ^a   Huang, Diyun ^a   Chen, Hui ^a   Barklund, Anna ^a   Miller, Eric ^a   Wei, Cailin ^a   Vemagiri, Jeevan ^a  

^a Lumera Corporation   (United States)

Author keywords

Electro optic (EO) polymer; Environmental testing; Modulator; Optical waveguide; Photostability

Indexed keywords

1550 NM; ADHESION PROPERTIES; COEFFICIENT OF THERMAL EXPANSION; ELECTRO-OPTIC (EO) POLYMER; ELECTRO-OPTIC POLYMERS; ELECTRODE MATERIAL; ELECTROOPTIC POLYMER; ENVIRONMENTAL STRESS; EO POLYMER; HERMETICALLY SEALED PACKAGES; HIGH OPTICAL POWER; HIGH TEMPERATURE; PACKAGED DEVICE; PHOTOCHEMICAL STABILITY; PHOTOSTABILITY; TEMPERATURE CYCLE TESTING; THERMALLY STABLE;

ARCHITECTURAL DESIGN; ENVIRONMENTAL TESTING; INTEGRATED OPTOELECTRONICS; MATERIALS TESTING; METAL CLADDING; MODULATION; OPTICAL WAVEGUIDES; ORGANIC POLYMERS; POLYMERS; THERMAL EXPANSION; WAVEGUIDES;

LIGHT MODULATORS;

EID: 66949158369     PISSN: 07338724     EISSN: None     Source Type: Journal    
DOI: 10.1109/JLT.2009.2014178     Document Type: Article

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