Monitoring the fracture behavior of SiCp/Al alloy composites using infrared lock-in thermography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7294, Issue , 2009, Pages

  Kordatos, E Z ^a   Myriounis, D P ^a,b   Hasan, S T ^b   Matikas, T E ^a  

^a UNIVERSITY OF IOANNINA   (Greece)

^b SHEFFIELD HALLAM UNIVERSITY   (United Kingdom)

Author keywords

Fatigue crack growth; Heat treatment; Lock in thermography; MMCs; Particle reinforced Al alloys

Indexed keywords

ALLOY COMPOSITES; ALUMINUM ALLOY MATRICES; COMPLIANCE METHOD; CRACK GROWTH; CRACK GROWTH RATES; CYCLIC LOADINGS; DISTRIBUTION OF TEMPERATURE; FATIGUE CRACK GROWTH; FATIGUE CYCLES; FRACTURE BEHAVIOR; FUNCTION OF TIME; HEAT WAVES; INFRA-RED CAMERAS; INTRINSIC ENERGY; LOCK-IN THERMOGRAPHY; METAL MATRIX COMPOSITES; MMCS; NONDESTRUCTIVE METHODS; PARTICLE-REINFORCED AL ALLOYS; POST PROCESSING; REFERENCE LINES; SILICON CARBIDE PARTICLES; STRAIGHT LINES; TEMPERATURE PROFILES; THERMAL IMAGES; THERMO-MECHANICAL COUPLING;

AEROSPACE ENGINEERING; ALUMINA; ALUMINUM; ALUMINUM ALLOYS; CLIMATOLOGY; COMPOSITE MICROMECHANICS; CRACK TIPS; CRACKING (CHEMICAL); FATIGUE CRACK PROPAGATION; FATIGUE OF MATERIALS; HEAT TREATMENT; REMOTE SENSING; SECURITY SYSTEMS; SILICON CARBIDE; THERMOGRAPHY (IMAGING); THERMOGRAPHY (TEMPERATURE MEASUREMENT);

METALLIC MATRIX COMPOSITES;

EID: 66749115682     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.815207     Document Type: Conference Paper

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