Comparison between back-to-back and matrix converters based on thermal stress of the switches

IEEE International Symposium on Industrial Electronics

Volumn 2, Issue , 2004, Pages 1081-1086

  Casadei, D ^a   Grandi, G ^a,b   Rossi, C ^a,b   Trentin, A ^a   Zarri, L ^a  

^a UNIVERSITY OF BOLOGNA   (Italy)

^b IEEE   (Italy)

Author keywords

Back to Back converter; Matrix converter; Switch losses.; Switch thermal stress

Indexed keywords

BACK-TO-BACK CONVERTER; CONVERTER TOPOLOGIES; JUNCTION TEMPERATURES; LOAD POWER; MATRIX CONVERTER; MAXIMUM OUTPUT POWER; OUTPUT FREQUENCY; OUTPUT POWER; SIMULATION RESULT; SWITCHING DEVICES; THERMAL MODEL;

INDUSTRIAL ELECTRONICS; POWER CONVERTERS; STRENGTH OF MATERIALS; THERMAL STRESS; THERMOELASTICITY;

SWITCHES;

EID: 66549120980     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISIE.2004.1571964     Document Type: Conference Paper

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