Modeling temperature gradient evolution of CoSb3 material for thermoelectric devices during spark plasma sintering

Materials Transactions

Volumn 50, Issue 4, 2009, Pages 782-790

  Cai, Yanhong ^a   Zhao, Degang ^a,b   Zhao, Xueying ^a   Chen, Lidong ^a   Jiang, Wan ^a   Zhai, Pengcheng ^c  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c WUHAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Finite element method; Microstructuiv; Spark plasma sintering; Temperature distribution; Thermoelectric material

Indexed keywords

ELECTRICAL RESISTIVITY; HIGHER TEMPERATURES; HIGHEST TEMPERATURE; INTERIOR TEMPERATURE; MICROSTRUCTUIV; NON-UNIFORM MICROSTRUCTURE; OPTIMIZATION METHOD; RADIAL TEMPERATURE GRADIENTS; SINTERING PROCESS; TEMPERATURE GRADIENT; THERMOELECTRIC COUPLES; THERMOELECTRIC DEVICES; THERMOELECTRIC MATERIAL; THERMOELECTRIC PROPERTIES;

ELECTRIC RESISTANCE; ELECTRIC SPARKS; MECHANICAL PROPERTIES; PLASMAS; SPARK PLASMA SINTERING; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMAL GRADIENTS; THERMOANALYSIS; THERMOCOUPLES; THERMOELECTRIC EQUIPMENT;

FINITE ELEMENT METHOD;

EID: 66449116637     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MRA2008203     Document Type: Article

References (20)

1. K. Vanmeensel. A. Laptev. J. Hennieke. J. Vleugels and O. Van der Biest: Acta Mater, 53 (2005) 4379-4388.
2. K. A. Khor, L. G. Yu. O. Andersen and G. Stephani: Mater. cei. Eng. A 356(2003) 130-135.
3. E. Fleury. J. H. Lee. S. H. Kim. W, T. Kim. J. S. Kim and D. H. Kim: Metall. Mater. Trans. A 34 (2003) 841-849.
4. A. Zavaliangos, J. Zhang. M. Krammer and J. R. Groza: Mater. Sci, Eng. A 379 (2004) 218-228.
5. W. Yucheng and F. Zhengyi: Mater. Sci. Eng. B 90 (2002) 34-37.
6. X. Wang, S. R. Casolco. G. Xu and J. E. Garay: Acta Mater, 55 (2007 ) 3611-3622.
7. U. Anselmi-Tamburini, S. Gennari. J. E. Garay and Z. A. Munir: Mater. Sci. Eng. A 394 (2005) 139-148.
8. F. J. DiSalvo: Science 285 (1999) 703-706.
9. S. Furuyama. T. Iida. S. Matsui. M. Akasaka. K. Nishio and Y. Takanashi: J. Alloy. Compd. 415 (2006) 251-256.
10. J. Fan, L. Chen. S. Bai and X. Shi: Mater. Lett. 58 (2004) 3876-3878.
11. E. M. Hcian. A. Feng and Z. A. Munir: Acta Mater, 50 12002) 33313346.
12. K. Matsugi. H. Kurumoto. T. Hatayama and O. Yanagisawa: J. Mater, Process, Technol. 146 (2004) 274-281.
13. X. Y. Zhao. X. Shi. L. D. Chen. W. Q, Zhang. W. B. Zhang and Y. Z. Pei: J. Appl. Phys. 99 (2006) 053711.
14. L. Yang. J. S. Wu and L. T. Zhang: J, Alloy. Compd. 375 (2004) 114119.
15. A. Weidcnkaff. R, Robert. M. Aguirre. L. Boeher. T. Lippen and S. Canulescu: Renewable Energy 33 (2008) 342-347.
16. G. Chen, M. S. Dresselhaus. G. Dresselhaus. J.-P. Fleurial and T. Caillat: Int. Mater. Rev. 48 (2003) 45-66.
17. K. T. Wojciechowski: Mater. Res. Bull. 37 (2002) 2023-2033.
18. S.-Chul Ur, J.-Chul Kwon and Il.-Ho Kim: J, Alloy. Compd. 442 (2007) 358-361.
19. L. I. Anatyehuk: Physics of thermoelectricity. (Institute of Thermoelectricity Kyiv. Chernivtsi. 1998) pp, 172-177.
20. A. L. Chamberlain. W. G, Fahrenholtz. G. E. Hilmas and D. T. Ellerhy: J. Am, Ceram. Soc, 87 (2004) 1170-1172.