Deep silicon etch for TSVs with improved via profile/process control

Solid State Technology

Volumn 52, Issue 4, 2009, Pages 22-25

  Eaton, Brad ^a   Kumar, Ajay ^a   Pamarthy, Sharma ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOSCH PROCESS; DIELECTRIC LAYER; EMERGING TECHNOLOGIES; ETCH DEPTH; ETCH RATES; INTEGRATION PROCESS; PROFILE CONTROL; SEED LAYER;

EID: 66249122055     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (1)

1. "Market & Technology Analysis. 3-D TSV Interconnects Equipment & Materials - July 2008 Report," www.yole.fr.