Plasma-enhanced catalysis of propane and isopropyl alcohol at ambient temperature on a MnO2-based catalyst

Applied Catalysis B: Environmental

Volumn 90, Issue 1-2, 2009, Pages 74-82

  Jarrige, Julien ^a   Vervisch, Pierre ^a  

^a Unité Mixte de Recherche   (France)

Author keywords

MnO2; Non thermal plasma; Post plasma treatment; VOCs removal

Indexed keywords

AMBIENT TEMPERATURES; CARBON OXIDE; CONCENTRATION OF; CORONA DISCHARGES; DECOMPOSITION MECHANISM; DECOMPOSITION RATE; DEGRADATION MECHANISM; DESTRUCTION AND REMOVAL EFFICIENCY; EFFICIENT DECOMPOSITION; GAS COMPOSITIONS; HAZARDOUS ORGANIC COMPOUNDS; HIGH CONCENTRATION; ISOPROPYL ALCOHOLS; MNO2; NON-THERMAL PLASMA; ORGANIC BYPRODUCTS; POST TREATMENT; POST-PLASMA TREATMENT; PULSED CORONA DISCHARGES; REACTIVE OXYGEN SPECIES; ROOM TEMPERATURE; VOCS REMOVAL;

ACETONE; AIR POLLUTION; ATMOSPHERIC PRESSURE; ATMOSPHERIC TEMPERATURE; CATALYSIS; CATALYSTS; CATALYTIC OXIDATION; DECOMPOSITION; DEGRADATION; EFFLUENTS; ELECTRIC CORONA; ELECTRIC DISCHARGES; GAS DISCHARGE TUBES; MANGANESE COMPOUNDS; ORGANIC POLYMERS; OZONE; PLASMAS; PROPANE; REMOVAL; VOLATILE ORGANIC COMPOUNDS;

PLASMA APPLICATIONS;

EID: 66149139787     PISSN: 09263373     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apcatb.2009.02.015     Document Type: Article

References (32)

1. Penetrante B.M., Hsiao M.C., Bardsley J.N., Merritt B.T., Vogtlin G.E., Kuthi A., Burkhart C.P., and Bayless J.R. Plasma Sources Sci. Technol. 6 (1997) 251
2. Sobacchi M.G., Saveliev A.V., Fridman A.A., Gutsol A.F., and Kennedy L.A. Plasma Chem. Plasma Process. 23 (2003) 347
3. Jarrige J., and Vervisch P. Plasma Chem. Plasma Process. 27 (2007) 241
4. Marotta E., Callea A., Ren X., Rea M., and Paradisi C. Int. J. Plasma Environ. Sci. Technol. 1 (2007) 39
5. Kogelschatz U. Plasma Chem. Plasma Process. 23 (2003) 1
6. Mok Y.S., Nam C.M., and Cho M.H. IEEE Trans. Plasma Sci. 30 (2002) 408
7. Rosocha L.A., and Korzekwa R.A. J. Adv. Oxid. Technol. 4 (1999) 247
8. Van Durme J., Dewulf J., Sysmans W., Leys C., and Van Langenhove H. Chemosphere 68 (2007) 1821
9. Oda T., Yamashita R., Hagai I., Takahashi T., and Masuda S. IEEE Trans. Ind. Appl. 32 (1996) 118
10. Magne L., Pasquiers S., Edon V., Jorand S., Postel C., and Amorim J. J. Phys. D: Appl. Phys. 38 (2005) 3446
11. Lee H.M., and Chang M.B. Plasma Chem. Plasma Process. 21 (2001) 329
12. Tonkyn R.G., Barlow S.E., and Orlando T.M. J. Appl. Phys. 80 (1996) 4877
13. Oda T., Kumada A., Tanaka K., Takahashi T., and Masuda S. J. Electrostat. 35 (1995) 93
14. Rudolph R., Francke K.P., and Miessner H. Plasma Chem. Plasma Process. 22 (2002) 401
15. Kim H.H. Plasma Process. Polym. 1 (2004) 91
16. Ayrault C., Barrault J., Blin-Simiand N., Jorand F., Pasquiers S., Rousseau A., and Tatibouet J.M. Catal. Today 89 (2004) 75
17. Magureanu M., Mandache N.B., Parvulescu V.I., Subrahmanyam C., Renken A., and Kiwi-Minsker L. Appl. Catal. B: Environ. 74 (2007) 270
18. Subrahmanyam C., Renken A., and Kiwi-Minsker L. Plasma Chem. Plasma Process. 27 (2007) 13
19. Holzer F., Roland U., and Kopinke F.D. Appl. Catal. B: Environ. 38 (2002) 163
20. Roland U., Holzer F., and Kopinke F.D. Appl. Catal. B: Environ. 58 (2005) 217
21. Futamura S., Zhang A., Einaga H., Kabashima H., and Hwan L.Y. Catal. Today 89 (2004) 89
22. Guaitella O., Thevenet F., Puzenat E., Guillard C., and Rousseau A. Appl. Catal. B: Environ. 89 (2008) 296
23. Besov A.S., and Vorontsov A.V. Plasma Chem. Plasma Process. 27 (2007) 624
24. Kim H.H., Ogata A., and Futamura S. Appl. Catal. B: Environ. 79 (2008) 356
25. Francke K.P., Miessner H., and Rudolph R. Plasma Chem. Plasma Process. 20 (2000) 393
26. Demidiouk V., and Chae J.O. IEEE Trans. Plasma Sci. 33 (2005) 157
27. Marques R., Da Costa S., and Da Costa P. Appl. Catal. B: Environ. 82 (2008) 50
28. Magureanu M., Mandache N.B., Eloy P., Gaigneaux E.M., and Parvulescu V.I. Appl. Catal. B: Environ. 61 (2005) 12
29. Futamura S., Zhang A., Einaga H., and Kabashima H. Catal. Today 72 (2002) 259
30. Delagrange S., Pinard L., and Tatibouet J.M. Appl. Catal. B: Environ. 68 (2006) 92
31. Han S.B., and Oda T. Plasma Sources Sci. Technol. 16 (2007) 413
32. Jarrige J., and Vervisch P. J. Appl. Phys. 99 (2006) 10.1063/1.2202700