Carbon nanotube field emission cathodes fabricated with chemical displacement plating

Applied Surface Science

Volumn 255, Issue 17, 2009, Pages 7753-7758

  Fan, Y C ^a   Liu, Y M ^a   Chen, Y C ^a   Sung, Y ^b   Ger, M D ^a  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Carbon nanotube; Electroless plating; Field emission; Galvanic displacement

Indexed keywords

CARBON NANOTUBES; ELECTROLESS PLATING; FABRICATION; FIELD EMISSION; FIELD EMISSION DISPLAYS; LIME; YARN; ZINC COATINGS;

CHEMICAL DISPLACEMENTS; COMPOSITE EMITTERS; DISPERSION PROCESS; DISPLACEMENT METHOD; EMISSION PERFORMANCE; GALVANIC DISPLACEMENT; PLATING SOLUTIONS; UNIFORM DISTRIBUTION;

FIELD EMISSION CATHODES;

EID: 66049085735     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2009.04.164     Document Type: Article

References (20)

1. Iijima S. Nature 354 (1991) 56
2. Rinzler A.G., Hafner J.H., Nikolaev P., Lou L., Kim S.G., Tomanek D., Norlander P., Colbert D.T., and Smalley R.E. Science 269 (1995) 1550
3. de Heer W.A., Châtelain A., and Ugarte D. Science 270 (1995) 1179
4. Itoh S., Tanaka M., and Tonegawa T. J. Vac. Sci. Technol. B 22 (2004) 1362
5. Sarrazin P. Carbon Nanotubes: Science and Applications (2004), CRC pp. 195-211
6. Choi Y.S., Kang J.H., Kim H.Y., Lee B.G., Lee C.G., Kang S.K., Jin Y.W., Kim J.W., Jung J.E., and Kim J.M. Appl. Surf. Sci. 221 (2004) 370
7. Wang Q.H., Setlur A.A., Lauerhaas J.M., Dai J.Y., and Seelig E.W. Appl. Phys. Lett. 72 (1998) 2912
8. Jung J.E., Jin Y.W., Choi J.H., Park Y.J., Ko T.Y., Chung D.S., Kim J.W., Jang J.E., Cha S.N., Yi W.K., Cho S.H., Yoon M.J., Lee C.G., You J.H., Lee N.S., Yoo J.B., and Kim J.M. Physica B 323 (2002) 71
9. Croci M., Arfaoui I., Stockli T., Chatelain A., and Bonard J.-M. Microelectron. J. 35 (2004) 329
10. Liao Q., Zhang Y., Xia L., Gao Z., Huang Y., Qi J., Chang Y., and Zhang H. Carbon 47 (2007) 1471
11. Klinke C., Kurt R., and Bonard J.-M. J. Phys. Chem. B 106 (2002) 11191
12. Seidel R., Duesberg G.S., Unger E., Graham A.P., Liebau M., and Kreupl F. J. Phys. Chem. B 108 (2004) 1888
13. Choi W.B., Chung D.S., Kang J.H., Kim H.Y., Jin Y.W., Han I.T., Lee Y.H., Jung J.E., Lee N.S., Park G.S., and Kim J.M. Appl. Phys. Lett. 75 (1999) 3129
14. Choi W.B., Jin Y.W., Kim H.Y., Lee S.J., Yun M.J., Kang J.H., Choi Y.S., Park N.S., Lee N.S., and Kim J.M. Appl. Phys. Lett. 78 (2001) 1547
15. Chen X.H., Peng J.C., Li X.Q., Deng F.M., Wang J.X., and Li W.Z. J. Mater. Sci. Lett. 20 (2001) 2057
16. Chen X.H., Chen C.S., Xiao H.N., Liu H.B., Zhou L.P., Li S.L., and Zhang G. Tribol. Int. 39 (2006) 22
17. Chen X., Zhang G., Chen C., Zhou L., Li S., and Li X. Adv. Eng. Mater. 5 (2003) 514
18. Chen W.X., Tu J.P., Wang L.Y., Gan H.Y., Xu Z.D., and Zhang X.B. Carbon 41 (2003) 251
19. Liu Y.M., Sung Y., Chen Y.C., Lin C.T., Chou Y.H., and Ger M.D. Electrochem. Solid State Lett. 10 (2007) 101
20. Carraro C., Maboudian R., and Magagnin L. Surf. Sci. Rep. 62 (2007) 499-525