High-resolution piezo inkjet printhead fabricated by three dimensional electrical connection method using through glass via

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2009, Pages 507-510

  Murata, M ^a   Kondoh, T ^a   Yagi, T ^a   Funatsu, N ^a   Tanaka, K ^a   Tsukuni, H ^a   Ohno, K ^a   Usami, H ^a   Nayve, R ^a   Inoue, N ^a   Seto, S ^a   Morita, N ^a  

^a FUJI XEROX CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DENSE INTEGRATION; ELECTRICAL CONNECTION; ETCHING METHOD; GLASS SUBSTRATES; HIGH RESOLUTION; INK DROPS; MATRIX ARRAYS; MULTIPLE JETTING; PB(ZR ,TI)O; PIEZO ACTUATOR; POLYIMIDE FILM; PRINT HEAD; PZT; SI SUBSTRATES; SPRAY COATING; THROUGH HOLE;

DROPS; ELECTRIC CONNECTORS; GLASS; INK; LEAD; PIEZOELECTRIC TRANSDUCERS; POLYIMIDES; ZIRCONIUM;

SUBSTRATES;

EID: 65949103208     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2009.4805430     Document Type: Conference Paper

References (6)

1. M. Murata, M. Kataoka, R. Nayve, A. Fukugawa, Y. Ueda, T. Mihara, M. Fujii, and T. Iwamori, "High Resolution Long Array Thermal Ink Jet Printhead with On-Chip LSI Heater Plate and Micromachined Si Channel Plate," IEICE Trans. ELECTRONICS, vol. E-84-C, No.12, December, pp. 1792-1800, 2001 (Pubitemid 33774054)
2. R. Nayve, A. Fukugawa, M. Fujii, and M. Murata, "HIGH RESOLUTION LONG ARRAY THERMAL INK JET PRINTHEAD FABRICATED BY ANISOTROPIC WET ETCHING AND DEEP SI RIE", in Tech. Digest MEMS2003 Conference, Kyoto, January 19-23, 2003, pp. 456-461.
3. M. Kaneko, K. Nakajima, and H. Matsuda, "High Speed High Image Quality Printing on Plain Paper Using Symmetrically Arranged Color Bubble Jet Print Head", in Tech. Digest NIPJ9, New Orleans, September 29- October 4, 2003, pp. 354-358.
4. M. Okumura and T. Takahashi, "Novel Micro Piezo Technology for Ink Jet Printhead", in Tech. Digest NIP23, Anchorage, September 16-11, 2007, pp. 314-318.
5. S. Seto, H. Nakamura, M. Murata, and N. Morita, "Thin Film Piezo Inkjet Printhead having Matrix Nozzle Arrangement using MEMS Technology", in Tech. Digest PPIC 2008, Tokyo, June 25-27, 2008, pp. 52-55.
6. X. X. Zhang and J. P. Raskin, "Low-Temperature Wafer Bonding: A Study of Void Formation and Influence on Bonding Strength", J. Microelectromech. Syst., vol. 14, pp. 368-382, 2005.