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Volumn , Issue , 2009, Pages 152-158

A simple method for comparative study on the thermal performance of light emitting diodes (LED) and fluorescent lamps

Author keywords

[No Author keywords available]

Indexed keywords

AIR-CONDITIONED BUILDINGS; COMPARATIVE STUDIES; HEAT DISSIPATION; HIGH BRIGHTNESS; INPUT POWER; LIGHT ENERGY; LUMINOUS EFFICACY; OVERALL ENERGY EFFICIENCY; SIMPLE METHOD; THERMAL PERFORMANCE; TOTAL POWER;

EID: 65949094815     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2009.4802648     Document Type: Conference Paper
Times cited : (19)

References (21)
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    • Zhou, J.M.1    Yan, W.2
  • 6
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    • J. Petroski, "Thermal Challengs facing new generation LEDs for lighting applications", Proceedings of SPIE Vol4776, 2003, pp. 215-222.
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    • Petroski, J.1
  • 8
    • 52349094322 scopus 로고    scopus 로고
    • "An estimator of luminous flux for enhanced control of high brightness LEDs"
    • Jun., Rhodes Greece
    • J. Garcia, D. G. Lamar, M. A. Costa, J. M. Alonso, M. R. Secades, "An estimator of luminous flux for enhanced control of high brightness LEDs", in Proc. IEEE PESC'08, Jun. 2008, Rhodes Greece. pp. 1852-1856.
    • (2008) In Proc. IEEE PESC'08 , pp. 1852-1856
    • Garcia, J.1    Lamar, D.G.2    Costa, M.A.3    Alonso, J.M.4    Secades, M.R.5
  • 9
    • 33747442431 scopus 로고    scopus 로고
    • Cooling performance of silicon-based thermoelectric device on high power LED
    • 1519885, Proceedings - ICT'05: 24th International Conference on Thermoelectrics
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    • (2005) International Conference on Thermoelectrics, ICT, Proceedings , vol.2005 , pp. 53-56
    • Cheng, J.-H.1    Liu, C.-K.2    Chao, Y.-L.3    Tain, R.-M.4
  • 10
    • 34548151549 scopus 로고    scopus 로고
    • A microjet array cooling system for thermal management of high-brightness LEDs
    • DOI 10.1109/TADVP.2007.898522, Special Section on Wafer-Level Packaging
    • X. B. Luo, S. Liu, "A microjet array cooling system for thermal management of high-brightness LEDs", IEEE Transactions on Advanced Packaging, vol30, no. 3, pp. 475-484, Aug 2007. (Pubitemid 47308005)
    • (2007) IEEE Transactions on Advanced Packaging , vol.30 , Issue.3 , pp. 475-484
    • Luo, X.1    Liu, S.2
  • 12
    • 34548092367 scopus 로고    scopus 로고
    • Thermal considerations for LED components in an automotive lamp
    • DOI 10.1109/STHERM.2007.352403, 4160884, Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM Proceedings 2007
    • J. Bielecki, A. S. Jwania, E. Khatib, T. Poorman, "Thermal considerations for LED components in an automotive lamp", Twenty Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, Proc. SEMI-THERM'07, Mar. 2007, San Jose USA. pp. 37-43. (Pubitemid 47287578)
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    • High thermal dissipation of ultra high power light-emitting diodes by copper electroplating
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.