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Volumn 50, Issue 3, 2009, Pages 683-688
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Phase transitions and thermal expansion behavior in AuCu alloy
a b a c |
Author keywords
Activation energy; Differential scanning calorimetry; Gold copper alloy; Order disorder transition; Thermal expansion curve; X ray diffractometry
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Indexed keywords
BREAK POINTS;
EXCESS VACANCIES;
FACE CENTERED CUBIC STRUCTURES;
GOLD COPPER ALLOY;
HEATING AND COOLING RATES;
HEATING PROCESS;
KISSINGER METHODS;
MIXED STRUCTURES;
ORDER-DISORDER TRANSITION;
ROOM TEMPERATURES;
SELF DIFFUSIONS;
TETRAGONAL STRUCTURES;
THERMAL EXPANSION BEHAVIORS;
THERMAL EXPANSION CURVE;
THERMAL EXPANSION MEASUREMENTS;
X-RAY DIFFRACTOMETRY;
ACTIVATION ENERGY;
ALLOYS;
CALORIMETERS;
CERIUM ALLOYS;
COOLING;
COPPER ALLOYS;
DIFFERENTIAL SCANNING CALORIMETRY;
DIFFRACTION;
DIFFRACTOMETERS;
DILATOMETERS;
GOLD ALLOYS;
GRAPH THEORY;
HEATING;
PHASE TRANSITIONS;
QUENCHING;
SCANNING;
THERMAL STRESS;
X RAY DIFFRACTION;
X RAY DIFFRACTION ANALYSIS;
THERMAL EXPANSION;
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EID: 65449183788
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.MER2008410 Document Type: Article |
Times cited : (23)
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References (35)
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