Simulations of mechanical behavior of polycrystalline copper with nano-twins

Acta Mechanica Solida Sinica

Volumn 21, Issue 3, 2008, Pages 189-197

  Wu, Bo ^a   Wei, Yueguang ^a  

^a INSTITUTE OF MECHANICS   (China)

Author keywords

cohesive model; finite element simulation; mechanical behavior; nanocrystalline twinned copper

Indexed keywords

COHESIVE INTERFACES; COHESIVE MODEL; FINITE ELEMENT SIMULATION; GRAIN SIZES; MATERIAL STRENGTHS; MECHANICAL BEHAVIOR; MICROSTRUCTURE EVOLUTIONS; NANOCRYSTALLINE TWINNED COPPER; POLYCRYSTALLINE COPPERS; STRAIN GRADIENT PLASTICITY THEORIES; SYSTEMATIC STUDIES;

COPPER; DUCTILITY; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MECHANICAL ENGINEERING; MICROSTRUCTURE; NANOCRYSTALLINE MATERIALS; THERMAL BARRIER COATINGS;

FINITE ELEMENT METHOD;

EID: 65449121488     PISSN: 08949166     EISSN: 18602134     Source Type: Journal    
DOI: 10.1007/s10338-008-0822-5     Document Type: Article

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