Curing kinetics of bisphenol-A epoxy resin with polyamide by isothermal differential scanning calorimetry

Wuhan Ligong Daxue Xuebao/Journal of Wuhan University of Technology

Volumn 31, Issue 6, 2009, Pages 28-31

  Sun, Wen Bing ^a,b   Zhang, Chao Can ^a  

^a WUHAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUBEI NORMAL UNIVERSITY   (China)

Author keywords

Diffusion control; Epoxy resin; Isothermal cure; Kinetics; Polyamide 651

Indexed keywords

EID: 65349175237     PISSN: 16714431     EISSN: None     Source Type: Journal    
DOI: 10.3963/j.issn.1671-4431.2009.06.008     Document Type: Article

References (6)

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4. Schawe J E K. A Description of Chemical and Diffusion Control in Isothermal Kinetics of Cure Kinetic[J]. Thermochimica Acta, 2002(388): 299-312.
5. Wang C S, Lin C H. Novel Phosphorus-Containing Epoxy Resins[J]. Part II: Curing Kinetics. Polymer, 2000(41): 8579-8586.