Effects of agitation, current density and cyanide concentration on Cu-Zn alloy electroplating

European Journal of Scientific Research

Volumn 22, Issue 4, 2008, Pages 517-524

  Musa, Ahmed Y ^a   Slaiman, Q J M ^b   Kadhum, Abdul Amir H ^a   Takriff, Mohd Sobri ^a  

^a UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

^b AL NAHRAIN UNIVERSITY   (Iraq)

Author keywords

Agitation; Cu Zn alloys; Current efficiency; Electroplating

Indexed keywords

EID: 65349126966     PISSN: 1450216X     EISSN: 1450202X     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Fujiwara, Y., H., Enomoto, 2000. "Electrodeposition of β'-brass from cyanide bath with accumulative underpotential deposition of Zn", Journal of. Electrochemistry Society 147, pp.1840.
2. Ishkawa, M., H., Enomoto, M., Matsuoka, and C., Iwakura, 1994. "Effect of tetraborate ions on electrodeposition of nickel-copper alloy", Electrochimica Acta 39, pp. 2153-2162.
3. Lainer, V.I, 1970. "Electrodeposition of Alloys", Israel Program of Scientific Translation Ltd. Jerusalem.
4. Lowenheim, F.A., 1974. "Modern Electroplating", Wiley, New York
5. Senna, L.F., Díaz, S.L., and L. Sathler, 2003. "Electrodeposition of copper - zinc alloys in pyrophosphate-based electrolytes", Journal of Applied Electrochemistry 33, pp. 1155-1161.
6. Vagramyan, T.A., 1970. "Electrodeposition of alloys: mechanism of simultaneous reaction of metal ions", Israel Program of Scientific Translation Ltd. Jerusalem.
7. Vagramyan, T.A. and Z.A Solov' eva, 1961. "Technology of electrodeposition"., Robert Drapper Ltd, Teddington