Fabrication and characterization of a liquid-metal micro-droplet thermal switch

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 2, Issue , 2003, Pages 1427-1430

  Christensen, A O ^a   Jacob, J P ^a   Richards, C D ^a   Bahr, D F ^a   Richards, R F ^a  

^a Washington State University   (United States)

Author keywords

Batch production systems; Contacts; Fabrication; Heat transfer; Resistance heating; Silicon; Switches; Thermal factors; Thermal loading; Thermal resistance

Indexed keywords

ACTUATORS; CONTACTS (FLUID MECHANICS); DEFORMATION; DROP BREAKUP; DROP FORMATION; DROPS; FABRICATION; HEAT RESISTANCE; HEAT TRANSFER; LIQUID METALS; MICROSYSTEMS; SILICON; SUBSTRATES; SWITCHES; TRANSDUCERS;

BATCH MANUFACTURING; BATCH PRODUCTION; EXPERIMENTAL VALUES; FABRICATION AND CHARACTERIZATIONS; RESISTANCE-HEATING; THERMAL CONTACT RESISTANCE; THERMAL FACTORS; THERMAL LOADINGS;

SOLID-STATE SENSORS;

EID: 65349088071     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1217043     Document Type: Conference Paper

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