A coupled thermal-mechanical analysis of ultrasonic bonding mechanism

Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science

Volumn 40, Issue 2, 2009, Pages 196-207

  Zhang, Chunbo ^a   Li, Leijun ^a  

^a Utah State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND FORMATIONS; BOND REGIONS; CONTACT INTERFACES; FINITE ELEMENT MODELS; IN PROCESS; MECHANICAL FIELDS; NORMAL STRESS; PLASTIC STRAINS; SLIDE DISTANCES; THERMAL-MECHANICAL ANALYSIS; TRANSIENT DISTRIBUTIONS; ULTRASONIC BONDINGS; VON MISE;

ALUMINA; ALUMINUM FOIL; MECHANISMS; PLASTIC DEFORMATION; PLASTICS; THREE DIMENSIONAL; ULTRASONIC WELDING; WELDING;

ULTRASONICS;

EID: 64949172725     PISSN: 10735615     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11663-008-9224-9     Document Type: Article

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