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Volumn , Issue , 2008, Pages

Impact of additional factors in threshold voltage variability of metal/high-k gate stacks and its reduction by controlling crystalline structure and grain size in the metal gates

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALLINE FILMS; CRYSTALLINE STRUCTURES; GRAIN SIZES; METAL GATES; METAL/HIGH-K GATES; RANDOM DOPANT FLUCTUATIONS; THRESHOLD VOLTAGE VARIABILITIES; TIN METAL GATES;

EID: 64549100212     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2008.4796707     Document Type: Conference Paper
Times cited : (83)

References (5)
  • 1
    • 48649087666 scopus 로고    scopus 로고
    • Understanding Random Threshold Voltage Fluctuation by Comparing Multiple Fabs and Technologies
    • K. Takeuchi et al., "Understanding Random Threshold Voltage Fluctuation by Comparing Multiple Fabs and Technologies," IEDM p. 467 (2007).
    • (2007) IEDM , pp. 467
    • Takeuchi, K.1
  • 2
    • 46049099643 scopus 로고    scopus 로고
    • Suppression of Poly-Gate-Induced Fluctuations in Carrier Profiles of Sub-50nm MOSFETs
    • H. Fukutome et al., "Suppression of Poly-Gate-Induced Fluctuations in Carrier Profiles of Sub-50nm MOSFETs," IEDM p. 281 (2006).
    • (2006) IEDM , pp. 281
    • Fukutome, H.1
  • 3
    • 0017556846 scopus 로고
    • The work function of the elements and its periodicity
    • H. B. Michaelson, "The work function of the elements and its periodicity," J. Appl. Phys. 48 (1977) 4729.
    • (1977) J. Appl. Phys , vol.48 , pp. 4729
    • Michaelson, H.B.1
  • 4
    • 48649110624 scopus 로고    scopus 로고
    • Wide Controllability of Flatband Voltage by Tuning Crystalline Microstructures in Metal Gate Electrodes
    • K. Ohmori et al., "Wide Controllability of Flatband Voltage by Tuning Crystalline Microstructures in Metal Gate Electrodes," IEDM p. 345 (2007).
    • (2007) IEDM , pp. 345
    • Ohmori, K.1
  • 5
    • 64549098838 scopus 로고    scopus 로고
    • Production-Worthy HfSiON Gate Dielectric Fabrication Enabling EOT Scalability Down to 0.86 nm and Excellent Reliability by Polyatomic Layer Chemical Vapor Deposition Technique
    • D. Ishikawa et al., "Production-Worthy HfSiON Gate Dielectric Fabrication Enabling EOT Scalability Down to 0.86 nm and Excellent Reliability by Polyatomic Layer Chemical Vapor Deposition Technique," SSDM p. 846 (2007).
    • (2007) SSDM , pp. 846
    • Ishikawa, D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.