Losses calculation of IGBT module and heat dissipation system design of inverters

Diangong Jishu Xuebao/Transactions of China Electrotechnical Society

Volumn 24, Issue 3, 2009, Pages 159-163

  Hu, Jianhui ^a   Li, Jingeng ^a   Zou, Jibin ^a   Tan, Jiubin ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Heat dissipation system; Heat resistance; Inverter; Loss

Indexed keywords

DESIGN METHODS; HEAT DISSIPATION SYSTEM; INVERTER; JUNCTION TEMPERATURES; LOSSES CALCULATIONS; PRACTICAL FORMULAE; PRACTICAL METHODS; SWITCHING LOSS; SYSTEM DESIGNS; TEMPERATURE CALCULATIONS;

ACTIVE FILTERS; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); SPECIFIC HEAT; THERMAL EFFECTS;

HEAT RESISTANCE;

EID: 64049108761     PISSN: 10006753     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

1. Xu Mingjin, Zhang Hao, Dong Wu. Design of ventilation and heat sinking in high voltage inverter[J]. The World of Inverters, 2005, 9(5): 68-71.
2. Wang Dan, Mao Chengxiong, Fan Peng, et al. Design of heat sinking in high voltage variable frequency drive system[J]. Power Electronics, 2005, 39(2): 115-117.
3. Cao Yongjuan, Li Qiang, Lin Mingyao. Method of estimating power loss of IGBT based on PSPICE simulation[J]. Micro Motor, 2004, 37(6): 40-42.
4. Liu Wei, Xie Jinfang, Mo Yimin. The 600A IGBT switched circuit and design of the heat-emitting system[J]. Journal of Wuhan University of Technology, 2003, 25(9): 63-64, 68.
5. Xu Dianguo, Li Xiangrong. Power electronics in extreme temperature applications[J]. Transactions of China Electrotechnical Society, 2006, 21(3): 15-23.
6. Kim M.K., Jang K.Y., et al. A novel IGBT inverter module for low-power drive applications[C]. IEEE 33rd Annual Power Electronics Specialists Conference (PESC), 2002: 648-652.
7. Zhang Zhouyun, Xu Guoqing, Shen Xianglin. Analyzing and designing of dissipation system of inverter[J]. Journal of Tongji University (Natural Science), 2004, 32(6): 775-778.
8. Xie Shaoyin, Zhao Dunshu, Wang Shiping. Optimal design of section bar heat sinks[J]. Electro-Mechanical Engineering, 2001, 17(6): 28-32.
9. Fu Guicui, Gao Zexi. Analysis of geometric factors on effect upon the capability of heat sink of power component[J]. Chinese Journal of Electro Devices, 2003, 26(12): 354-357.
10. Yang Xu, Ma Jing, Zhang Xinwu, et al. Research on heatsinking mode of the power electronic equipment with forced cooling[J]. Power Electronics, 2000, 34(8): 36-38.
11. Liu Yibing. Research on heat dissipation technology for power device[J]. Journal of Hunan University of Technology, 2007, 21(4): 77-79.