Thermophysical properties of stable and metastable liquid copper and nickel by molecular dynamics simulation

Applied Physics A: Materials Science and Processing

Volumn 95, Issue 3, 2009, Pages 661-665

  Wang, H P ^a   Wei, B ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION COEFFICIENTS; EMBEDDED-ATOM METHOD POTENTIALS; MEAN SQUARE DISPLACEMENTS; MELTING TEMPERATURES; METASTABLE LIQUIDS; MOLECULAR DYNAMICS SIMULATIONS; THERMO-PHYSICAL PROPERTIES; UNDERCOOLED LIQUIDS;

CALORIMETRY; DIFFUSION; LIQUIDS; MELTING POINT; MOLECULAR DYNAMICS; MOLECULAR MECHANICS; NICKEL; NICKEL ALLOYS; SPECIFIC HEAT;

DYNAMICS;

EID: 63949087939     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/s00339-009-5183-5     Document Type: Article

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