Development of new model reflow oven for lead-free soldering

Furukawa Review

Volumn , Issue 26, 2004, Pages 31-36

  Yamane, Motohiro ^a   Orita, Nobuaki ^b   Miyazaki, Koichi ^b   Zhou, Weiming ^b  

^a Industrial Equipment Dept

^b Prod Engineering Development Center   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INFRARED HEATERS; LEAD-FREE SOLDERING; REFLOW SOLDERING;

BLOW MOLDING; HEAT RADIATION; HEAT RESISTANCE; HEAT TRANSFER; MATHEMATICAL MODELS; OPTIMIZATION; OVENS; PRINTED CIRCUIT BOARDS;

SOLDERING;

EID: 6344289333     PISSN: 13481797     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. M. Shibamura: Development and evaluation of reflow oven for lead-free soldering process, Jisso Gijutsu Periodical, 219, 48 (2003). (in Japanese)
2. T. Mizushina, H. Ogino: Transport Phenomena, Sangyo Tosho Publisher (in Japanese)
3. K. Nakao, A. Hiraizumi, E. Iwasaki: Reflow Oven for a Lead-Free Soldering Process, Furukawa Review, 106, 25 (2000).