Multivariant measurement for thin film adhesion as a function of temperature and thin film thickness

2003 Nanotechnology Conference and Trade Show - Nanotech 2003

Volumn 3, Issue , 2003, Pages 254-257

  Chiang, Martin Y M ^a   Song, Rui ^a   Karim, Alamgir ^a   Amis, Eric J ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPUTER SIMULATION; DELAMINATION; ELECTRONIC EQUIPMENT; RELIABILITY; SUBSTRATES; THICKNESS MEASUREMENT;

ADHESION RELIABILITY; INTERFACIAL FAILURE; MULTIVARIANT MEASUREMENTS;

THIN FILMS;

EID: 6344253155     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. J. C. Zhao (2001), Advanced Engineering Materials, 3, 143, 2001.
2. E. J. Amis, A. Sehgal, J. C. Meredith and A. Karim Abstracts of papers of the American Chemical Society 221:70-BTEC, Part 2, 2001.
3. E. J. Amis, Abstracts of papers of the Amer. Chem. Soc. 222:339-Poly, Part 2, 2001.
4. M.Y.M. Chiang, W. L. Wu, J. He and E. J. Amis, Thin Solid Films, in press.
5. R. Song, M.Y.M. Chiang, A. J. Crosby, A. Karim and E. J. Amis, "The combinatorial approach to the thin film adhesion as a function of film thickness and surface energy," in preparation.
6. D. B. Bogy, J. of Applied Mechanics, 35, 460, 1968.
7. Pipes R. B. and Pagano, N. J., J. of Composites Materials, 4, 538, 1970.
8. T.C.T Ting and S. C. Chou, Int. J. Solids Structures 17, 1057, 1981.
9. H. K. Stolarski and M.Y.M. Chiang, Int. J. Solids Structures 25, 75, 1989.
10. ABAQUS, Finite Element Analysis Code and Theory (Standard and CAE), Version 6.2, Hibbitt, Karlsson & Sorensen, Inc., RI, USA, 2000.