Mechanical wafer stability enhancements and texturing effects of remote downstream plasma etching

Proceedings of the 3rd World Conference on Photovoltaic Energy Conversion

Volumn B, Issue , 2003, Pages 1419-1422

  Schneider, A ^a   Pernau, T ^a   Peter, K ^a   Fath, P ^a  

^a UNIVERSITY OF KONSTANZ   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CELL FABRICATION; MECHANICAL STABILITY; VOLATILE REACTION PRODUCTS;

ELECTRIC POTENTIAL; ELECTRON MICROSCOPY; HYDROCHLORIC ACID; MICROCRACKS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA ETCHING; SOLAR CELLS; ULTRAVIOLET RADIATION;

SILICON WAFERS;

EID: 6344244532     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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2. th IEEE PVSC, New Orleans, Louisiana (USA), 2002, p. 146-149.
3. S. Schaefer, R. Lüdemann, Low Damage Reactive Ion Etching for Photovoltaic Applications, J. Vac. Sci. Technol. A 17 (3), 749-754, 1999.
4. S. Schaefer, Plasmaätzen für die Photovoltaik, PhD thesis, University of Konstanz, UFO Dissertation Band 391, 2000.
5. ASTM: F394-78, Standard test method for biaxial flexure of ceramic substrates.
6. th IEEE PVSC, San Diego, California (USA), 1980, p. 929-934.
7. H. Jansen, M. de Boer, R. Legtenberg, Micromech. Microeng., 5, 115 (1995).
8. H. Jansen et al, Proceedings of the Tenth International Workshop on Micro Electromechanical Systems, 88, (1995).