Copper alloys from metal oxide precursors for high conductivity applications

Materials and Manufacturing Processes

Volumn 19, Issue 5, 2004, Pages 813-837

  Church, Benjamin C ^a   Sanders Jr , T H ^a   Cochran, Joe K ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Copper; Cu Ag; Cu Ni; Honeycomb; Invar; Powder metallurgy; Reduction; Sintering; Thermal conductivity; W Cu

Indexed keywords

COPPER ALLOYS; EXTRUSION; HEAT SINKS; MICROSTRUCTURE; POROSITY; POWDER METALS; REDUCTION; SINTERING; TENSILE STRENGTH; THERMAL CONDUCTIVITY; THIN FILMS;

CONVENTIONAL PROCESSING; HONEYCOMB; INVAR; THERMO-CHEMICAL POWDER PROCESSING;

MOS DEVICES;

EID: 6344243466     PISSN: 10426914     EISSN: None     Source Type: Journal    
DOI: 10.1081/AMP-200030547     Document Type: Conference Paper

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