Evaluating the 300 mm wafer-handling task in semiconductor industry

International Journal of Industrial Ergonomics

Volumn 34, Issue 6, 2004, Pages 459-466

  Wang, Mao Jiun J ^a   Chung, Hsiu Chen ^b   Wu, Hsin Chieh ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b HUAFAN UNIVERSITY   (Taiwan)

^c CHAOYANG UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

300 mm wafers; Biomechanics analysis; MAWL; Physiological responses; Semiconductor industry; Wrist posture

Indexed keywords

ACCIDENT PREVENTION; BIOMECHANICS; DISEASES; HEALTH CARE; JOB ANALYSIS; MUSCULOSKELETAL SYSTEM; PSYCHOPHYSIOLOGY; SILICON WAFERS;

COMPRESSION FORCES; MUSCULOSKELETAL DISORDERS; SEMICONDUCTOR INDUSTRY;

ERGONOMICS;

ADULT; ARTICLE; BIOMECHANICS; BODY POSTURE; ERGONOMICS; FEMALE; HUMAN; LUMBOSACRAL SPINE; MATERIALS HANDLING; MUSCULOSKELETAL DISEASE; OCCUPATIONAL HAZARD; OPERATOR; PHYSICAL STRESS; PRIORITY JOURNAL; PSYCHOPHYSIOLOGY; SEMICONDUCTOR; SHOULDER INJURY; SPINAL CORD COMPRESSION; WEIGHT LIFTING; WORK ENVIRONMENT; WRIST INJURY;

EID: 6344239395     PISSN: 01698141     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ergon.2004.05.006     Document Type: Article

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