Design of the thermally conductive mould to improve cooling characteristics of injection mould for a mouse

Transactions of the Korean Society of Mechanical Engineers, A

Volumn 33, Issue 3, 2009, Pages 201-209

  Ahn, Dong Gyu ^a   Kim, Hyun Woo ^a   Lee, Ki Yong ^a  

^a NONE

Author keywords

Cooling characteristics; Injection mould; Thermally conductive mould; Thickness of mould materials

Indexed keywords

BINARY ALLOYS; COOLING; COPPER ALLOYS; NICKEL ALLOYS; STRESS ANALYSIS; THERMAL STRESS; TOOL STEEL;

BASE STRUCTURE; COOLING CHARACTERISTICS; CU -NI ALLOYS; GEOMETRICAL ARRANGEMENTS; HIGH COOLING RATES; INJECTION MOULD; PROPER DESIGN; TRANSIENT HEAT TRANSFER;

MOLDS;

EID: 63049096306     PISSN: 12264873     EISSN: 22885226     Source Type: Journal    
DOI: 10.3795/KSME-A.2009.33.3.201     Document Type: Article

References (13)

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