Thermal management technologies for electronic packaging: Current capabilities and future challenges for modelling tools

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 527-532

  Bailey, C ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS ENGINEERING; ELECTRONICS PACKAGING; ENERGY MANAGEMENT; INDUSTRIAL MANAGEMENT; TEMPERATURE CONTROL;

ACTIVE COOLING; CURRENT CAPABILITIES; ELECTRONIC PACKAGES; ELECTRONIC PACKAGING; ELECTRONIC SYSTEMS; ENVIRONMENTAL FACTORS; FUTURE CHALLENGES; HARSH ENVIRONMENTS; MINIATURISATION; MODELLING TOOLS; PACKAGING TECHNOLOGIES; POWER DENSITIES; THERMAL MANAGEMENTS; VOLUMETRIC POWER DENSITIES;

TECHNOLOGY;

EID: 63049089329     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763487     Document Type: Conference Paper

References (7)

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