Vacuum insulation panels with Supporting elements in tension

Proceedings of the 29th International Thermal Conductivity Conference, ITCC29 and the Proceedings of the 17th International Thermal Expansion Symposium, ITES17

Volumn , Issue , 2008, Pages 100-108

  Feinerman, A D ^a   Lajos, R L ^a   Sood, V S ^a   Carlton, R J ^b  

^a University of Illinois at Chicago   (United States)

^b ILLINOIS WESLEYAN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON EMISSION; FILAMENTS (LAMP); SILICA; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMAL INSULATION; THERMAL STRESS; THERMOANALYSIS; VACUUM;

A THERMALS; ATMOSPHERIC LOADS; COMPRESSIVE LOADS; CROSS-SECTIONAL AREAS; EQUIVALENT THICKNESS; FAILURE MECHANISMS; FINE POWDERS; MATERIAL PROPERTIES; MATERIAL STRENGTHS; METAL ALLOYS; SILICA MICROSPHERES; SOLID-PHASE; TENSILE LOADS; THERMAL CONDUCTIONS; THERMAL CONDUCTORS; VACUUM INSULATION PANELS;

THERMAL EXPANSION;

EID: 62949243307     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. nd edition, McGraw Hill, pp. 634-640, and p. 697.
2. 2 www.matweb.com
3. 3 Feinerman, A., "Thermal Conductivity Insulation, " University of Illinois at Chicago patent filed 3/15/07.
4. 4 http://hyperphysics.phv-astr.gsu.edu/hbase/tables/thrcn. html.
5. 5 http://www.eoearth.org/article/Geology of asbestos.
6. 6 http://www.matweb.com/search/SpecificMaterial.asp?bassnum-PDUKEV29.