Precipitation under cyclic strain in solution-treated Al-4wt%Cu I: Mechanical behavior

TMS Annual Meeting

Volumn , Issue , 2009, Pages 129-134

  Farrow, Adam ^a   Laird, Campbell ^b  

^a LOS ALAMOS NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

Aluminum; Cyclic strain; Diffusion; Precipitation

Indexed keywords

AL-4WT%CU; AMBIENT TEMPERATURES; CYCLIC STRAIN; DEFORMATION BEHAVIORS; DISLOCATION DENSITIES; ELEVATED TEMPERATURES; FATIGUE FAILURES; FATIGUE STRIATIONS; FRACTURE SURFACES; GRAIN BOUNDARY PRECIPITATES; HETEROGENEOUS NUCLEATIONS; LATENT HARDENINGS; LOWER AVERAGES; MECHANICAL BEHAVIORS; ORIENTATION IMAGING MICROSCOPIES; PRECIPITATION; PRECIPITATION HARDENINGS; RAPID GROWTHS; ROLLED PLATES; ROOM TEMPERATURES; SCHMID FACTORS; SUPER SATURATIONS; TEM; TEXTURE EFFECTS; DEFORMATION BEHAVIOR; ELEVATED TEMPERATURE; GRAIN BOUNDARY PRECIPITATE; HETEROGENEOUS NUCLEATION; LATENT HARDENING; LOWER AVERAGE; MECHANICAL BEHAVIOR; ORIENTATION IMAGING MICROSCOPY; PRECIPITATION HARDENING; RAPID GROWTH; ROOM TEMPERATURE;

ALUMINA; ALUMINUM ALLOYS; COPPER ALLOYS; DUCTILE FRACTURE; FUNCTIONAL ELECTRIC STIMULATION; GRAIN BOUNDARIES; HARDENING; TEXTURES;

ALUMINUM;

EID: 62949223937     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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