Use of phase-change materials to enhance the thermal performance of building insulations

Proceedings of the 29th International Thermal Conductivity Conference, ITCC29 and the Proceedings of the 17th International Thermal Expansion Symposium, ITES17

Volumn , Issue , 2008, Pages 129-136

  Alderman, R J ^a   Yarbrough, D W ^b  

^a Alderman Research Ltd   (United States)

^b R and D Services Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY TEMPERATURES; BUILDING ENVELOPES; COOLING LOADS; HEAT FLOWS; HEATING LOADS; INSULATION LAYERS; INSULATION SYSTEMS; TEST CHAMBERS; THERMAL PERFORMANCE;

FLOW MEASURING INSTRUMENTS; HEAT FLUX; HEATING; INSULATION; PHASE CHANGE MATERIALS; PULSE CODE MODULATION; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMAL INSULATING MATERIALS; THERMAL STRESS; THERMOANALYSIS;

THERMAL EXPANSION;

EID: 62949107176     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Kosny, Jan, David Yarbrough, William Miller, Thomas Petrie, Phillip Childs, and Azam Mohiuddin Syed, "2006/07 Field Testing of PCM-Enhanced (Phase Change Material) Cellulose Fiber Insulation", Oak Ridge National Laboratory, Oak Ridge, TN (2007).
2. Zhang, Meng, M. A. Medina, and Jennifer King, "Development of a Thermally Enhanced Frame Wall with Phase-Chang Materials for On-Peak Air Conditioning Demand Reduction and Energy Savings in Residential Buildings", International Journal of Energy Research 29 795-809 (2005).
3. Kissock, J. K., J. Michael Hannig, and 1. Thomas, "Testing and Simulation of Phase Change Wallboard for Thermal Storage in Buildings", Proc. International Solar Energy Conference, Albuquerque, NM (1998).
4. Stovall, T. K., J. J. Tomlinson, "What are the Potential Benefits of Included Latent Storage in Common Wallboard?", J. Solar Energy Engineering 11 (1995).
5. Petrie, T. W., K. W. Childs, P. W. Childs, J. E. Christian, and D. J. Shramo, "Thermal Behavior of Mixtures of Perlite and Phase Change Material in a Simulated Climate", ASTM STP 1320, R. S. Graves and R. R. Zarr. Editors, American Society for Testing and Materials (1997) pp. 111-115.
6. Kosny, Jan, David W. Yarbrough, Thomas Petrie, Syed Azam Mohiuddin, "Performance of Thermal Insulation Containing Microencapsulated Phase Change Material", International Thermal Conductivity Conf., Birmingham, AL (2007).
7. ASTM C 518, "Standard Test Method for Steady-State Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus", 2006 Annual Book of ASTM Standards, Vol. 04.06 (2006) pp. 153-167.