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Volumn 164, Issue 2-3, 2009, Pages 948-953

Adsorption of copper from the sulphate solution of low copper contents using the cationic resin Amberlite IR 120

Author keywords

Amberlite IR 120; Copper; Electronic effluents; Ion exchange

Indexed keywords

ACID CONCENTRATIONS; ADSORPTION PROCESS; AMBERLITE IR-120; CATIONIC RESINS; CONTACT TIME; ELECTRONIC EFFLUENTS; ELECTRONIC INDUSTRIES; LANGMUIR ISOTHERMS; LOW COPPER CONTENTS; PROCESS PARAMETERS; RAFFINATE; SECOND ORDERS; SOLUTION PH; SULPHATE SOLUTIONS; SULPHURIC ACIDS; WASTE PROCESSING;

EID: 62949087898     PISSN: 03043894     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jhazmat.2008.08.103     Document Type: Article
Times cited : (72)

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