Mechanisms of films and coatings formation from gaseous and liquid precursors with low pressure plasma spray equipment

Surface and Coatings Technology

Volumn 203, Issue 15, 2009, Pages 2125-2130

  Dorier, J L ^a   Guittienne, Ph ^a   Hollenstein, Ch ^a   Gindrat, M ^b   Refke, A ^b  

^a EPFL   (Switzerland)

^b Sulzer Ltd   (Switzerland)

Author keywords

Chemical vapour deposition; Liquid injection; Mass spectrometry; Optical emission spectroscopy (OES); Plasma spraying; Thin film

Indexed keywords

AMORPHOUS CARBON; ATOMIC SPECTROSCOPY; CERAMIC COATINGS; CHARGE TRANSFER; CONVERSION EFFICIENCY; DEPOSITION; DEPOSITION RATES; DIAMOND FILMS; ELECTRODEPOSITION; EMISSION SPECTROSCOPY; ENTHALPY; GAS TURBINES; HIGH PERFORMANCE LIQUID CHROMATOGRAPHY; HYDROCARBONS; IONIZATION OF LIQUIDS; LIGHT EMISSION; LIQUIDS; MASS SPECTROMETERS; MASS SPECTROMETRY; METALS; MOLECULAR SPECTROSCOPY; OPTICAL EMISSION SPECTROSCOPY; OXYGEN; PHOTODISSOCIATION; PHOTORESISTS; PLASMA ACCELERATORS; PLASMA DEPOSITION; PLASMA JETS; PLASMA SPRAYING; PLASMAS; PROTECTIVE COATINGS; SILICON COMPOUNDS; SPACE PROBES; SPECTRUM ANALYSIS; SPRAYED COATINGS; THIN FILM DEVICES; THIN FILMS;

CHARGE EXCHANGES; CHEMICAL VAPOUR DEPOSITION; DENSE COATINGS; DISSOCIATION EFFICIENCIES; DISSOCIATIVE RECOMBINATIONS; ENTHALPY PROBES; EQUIPMENT DESIGNS; FILMS AND COATINGS; GASEOUS PRECURSORS; HEXAMETHYLDISILOXANE; HIGH DEPOSITION RATES; HIGHER HYDROCARBONS; IONISATION; LIQUID INJECTION; LIQUID PRECURSORS; LOW ENERGY ELECTRONS; LOW PRESSURE PLASMA SPRAYS; LOW PRESSURES; LOW-PRESSURE PLASMAS; METAL COATINGS; NON-EQUILIBRIUM PLASMAS; OPTICAL EMISSION INTENSITIES; PHYSICAL VAPOUR DEPOSITIONS; PLASMA CHEMISTRIES; PLASMA JET; SECONDARY REACTIONS; THERMAL PLASMA CVD; THERMALLY SPRAYED COATINGS; THIN LAYERS;

CHEMICAL VAPOR DEPOSITION;

EID: 62649092473     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2008.10.034     Document Type: Article

References (10)

1. Fauchais P. J. Phys. D: Appl. Phys. 37 (2004) R86
2. Loch M., and Barbezat G. In: Berndt C. (Ed). Thermal Spray: Surface Engineering via Applied Research (2000), ASM International, Material Park, OH, USA 1141
3. Gindrat M., Dorier J.-L., Hollenstein C., Loch M., Refke A., Salito A., and Barbezat G. In: Lugscheider E. (Ed). Proc. International Thermal Spray Conference 2002, Essen, Germany, 4-6 March 2002 (2002), DVS/IIW/ASM-TSS 459
4. Refke A., Barbezat G., Dorier J.-L., Gindrat M., and Hollenstein C. In: Marple B.R., and Moreau C. (Eds). Thermal Spray 2003: "Advancing the Science and Applying the Technology", Proc. of the International Thermal Spray Conference 2003, Orlando, CA, USA (May 5-8 2003), ASM International, Materials Park, OH 44073
5. Dorier J.-L., Jodoin B., Gindrat M., Blais A., Hollenstein C., and Barbezat G. Proc. of the 16th ISPC, Taormina, Italy (2003)
6. Rahmane M., Soucy G., and Boulos M.I. Rev. Sci. Instrum. 66 6 (1995) 3424
7. Beulens J.J., Gastineau C., Guerrassimov N., Koulidiati J., and Schram D.C. Plasma Chem. Plasma Process. 14 1 (1994) 15
8. Gindrat M., Dorier J.-L., Hollenstein Ch., Refke A., and Barbezat G. Plasma Sources Sci. Technol. 13 (2004) 484
9. Zhang W., and Catherine Y. Plasma Chem. Plasma Process. 11 4 (1991) 473
10. Sheehan C.H., and St-Maurice J.-P. Adv. Space Res. 33 (2004) 216