Plastic stencils for bottom-side chip attach: Adhesive deposits in the range of 0.2 mm to 2 mm can be produced using a single thickness plastic stencil

Electronic Packaging and Production

Volumn 37, Issue 13, 1997, Pages 68-72

  Whitmore, Mark ^a   MacKay, Colin ^a   Hobby, Alan ^a  

^a DEK Printing Machines Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

PLASTIC ADHESIVES; PLASTICS APPLICATIONS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUIT TESTING; SCREEN PRINTING;

PLASTIC STENCILS; SINGLE THICKNESS STENCIL;

ELECTRONICS PACKAGING;

EID: 6244247388     PISSN: 00134945     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. Quigley, K., and R. Lieske, "Using Metal Stencils for Bottomside Chip Attach," Proceedings of NEPCON West, February, 1997.
2. MacKay, C.A., "Printing SMT Adhesives," Electronic Production, January, 1997.